Patents by Inventor Tyler W. Smith

Tyler W. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995734
    Abstract: A recording device may record information continuously. Particular events which occur during recording may be of interest for review (e.g., audit, inspection). Events may be audited to ensure that the data gathered is not tampered with or corrupted and to provably establish an evidence chain of custody. Metadata may mark recorded data of an event, in whole or in part, for later review. Metadata may be identified as an audit tag which may identify particular occurrences during an event. An audit tag may be urgent or non-urgent. Notice of an urgent audit tag may be sent to a server prior to sending the recorded data associated with the audit tag. Recorded data may be cryptographically signed to protect the recorded data from tampering.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: May 28, 2024
    Assignee: Axon Enterprise, Inc.
    Inventors: Mark A. Hanchett, Patrick W. Smith, Tyler J. Conant, Aaron J. Kloc
  • Patent number: 5297716
    Abstract: A soldering tip is provided with a protrusion extending from its operative region to permit an opening to extend therethrough. Thermocouple wires are disposed in the opening and mechanically urged into thermal contact with the operative region. One embodiment of the present invention provides a protrusion extending from the central region of the soldering tip which is deformed by compression after thermocouple wires are inserted into an opening extending through the protrusion. An alternative embodiment of the present invention incorporates two protrusions to define a gap therebetween into which the thermocouple wires can be disposed. After disposing the wires in the gap, an annular member is placed around both protrusions and a spring urges the annular member downward to press the thermocouple against the bottom of the gap and in thermal contact with the central region of the soldering tip.
    Type: Grant
    Filed: April 12, 1993
    Date of Patent: March 29, 1994
    Assignee: Honeywell Inc.
    Inventors: Tyler W. Smith, Thomas A. Young