Patents by Inventor Tyrone Kuo

Tyrone Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package, display apparatus and manufacturing method of semiconductor package
    Patent number: 11243573
    Abstract: A semiconductor package includes a flexible substrate and a semiconductor device. The flexible substrate includes a device bonding region and a device top metallization structure including a plurality of device signal lines and a plurality of device power lines extended beyond the device bonding region. The semiconductor device is disposed on the device bonding region and includes an interconnecting metallization structure and a passivation layer covering the interconnecting metallization structure and revealing a plurality of interconnect contacts of the interconnecting metallization structure, wherein the plurality of interconnect contacts electrically connected to one another through the device top metallization structure.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: February 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Tung Hsu, Chang-Cheng Hung, Tyrone Kuo
  • SEMICONDUCTOR PACKAGE, DISPLAY APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
    Publication number: 20210333834
    Abstract: A semiconductor package includes a flexible substrate and a semiconductor device. The flexible substrate includes a device bonding region and a device top metallization structure including a plurality of device signal lines and a plurality of device power lines extended beyond the device bonding region. The semiconductor device is disposed on the device bonding region and includes an interconnecting metallization structure and a passivation layer covering the interconnecting metallization structure and revealing a plurality of interconnect contacts of the interconnecting metallization structure, wherein the plurality of interconnect contacts electrically connected to one another through the device top metallization structure.
    Type: Application
    Filed: April 28, 2020
    Publication date: October 28, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: CHENG-TUNG HSU, Chang-Cheng Hung, Tyrone Kuo