Patents by Inventor Tzer-Kun Lin

Tzer-Kun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-contact pick-up device
    Patent number: 6341769
    Abstract: A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: January 29, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Hung Lin, Tzer-Kun Lin, Yun-Chuan Tu, Hann-Tsong Wang, Chin-Ching Wu