Patents by Inventor Tzong-Che Ho
Tzong-Che Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9369788Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.Type: GrantFiled: December 30, 2014Date of Patent: June 14, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tzong-Che Ho, Yu-Wen Fan, Hong-Ren Chen, Chao-Ta Huang
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Publication number: 20160165358Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.Type: ApplicationFiled: December 30, 2014Publication date: June 9, 2016Inventors: Tzong-Che HO, Yu-Wen FAN, Hong-Ren CHEN, Chao-Ta HUANG
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Patent number: 9343651Abstract: An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a material of the sealing metal layer includes AgSn and is lead-free.Type: GrantFiled: June 7, 2012Date of Patent: May 17, 2016Assignee: Industrial Technology Research InstituteInventors: Lung-Tai Chen, Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan
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Patent number: 9236275Abstract: A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.Type: GrantFiled: October 26, 2012Date of Patent: January 12, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Nan Yeh, Chin-Hung Wang, Hsin-Li Lee, Jien-Ming Chen, Tzong-Che Ho, Li-Chi Pan
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Patent number: 9133018Abstract: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.Type: GrantFiled: October 2, 2009Date of Patent: September 15, 2015Assignee: Industrial Technology Research InstituteInventors: Lung-Tai Chen, Yu-Wen Hsu, Sheah Chen, Jing-Yuan Lin, Li-Chi Pan, Tzong-Che Ho
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Patent number: 8763457Abstract: A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.Type: GrantFiled: June 6, 2011Date of Patent: July 1, 2014Assignee: Industrial Technology Research InstituteInventors: Lung-Tai Chen, Yu-Wen Hsu, Tzong-Che Ho, Li-Chi Pan
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Patent number: 8693711Abstract: A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.Type: GrantFiled: December 21, 2009Date of Patent: April 8, 2014Assignee: Industrial Technology Research InstituteInventors: Tzong-Che Ho, Lung-Tai Chen, Yao-Jung Lee, Chao-Ta Huang, Li-Chi Pan, Yu-Sheng Hsieh
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Patent number: 8508022Abstract: An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.Type: GrantFiled: July 14, 2008Date of Patent: August 13, 2013Assignee: Industrial Technology Research InstituteInventors: Tzong-Che Ho, Jason Pan, Pin Chang, Chin-Horng Wang, Jung-Tai Chen, Hsin-Li Lee, Kai-Hsiang Yen
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Patent number: 8421216Abstract: A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.Type: GrantFiled: May 20, 2011Date of Patent: April 16, 2013Assignee: Industrial Technology Research InstituteInventors: Lung-Tai Chen, Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan
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Publication number: 20120260747Abstract: A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.Type: ApplicationFiled: June 6, 2011Publication date: October 18, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lung-Tai Chen, Yu-Wen Hsu, Tzong-Che Ho, Li-Chi Pan
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Publication number: 20120241938Abstract: An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a meterial of the sealing metal layer includes AgSn and is lead-free.Type: ApplicationFiled: June 7, 2012Publication date: September 27, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lung-Tai Chen, Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan
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Publication number: 20120146163Abstract: A microphone package structure is provided, including an integrated circuit (IC) structure and a microphone structure disposed thereover and electrically connected therewith. The IC structure includes a first semiconductor substrate with opposite first and second surfaces, and a first through hole disposed in and through the first semiconductor substrate. The microphone structure includes: a second semiconductor substrate with opposite third and fourth surfaces, wherein the third surface faces to the second surface of the first semiconductor substrate; a second through hole disposed in and through the second semiconductor substrate; an acoustic sensing device embedded in the second through hole and adjacent to the third surface; and a sealing layer disposed over the fourth surface of the second semiconductor substrate, defining a back chamber with the sealing layer, wherein the first through hole allows acoustic pressure waves to penetrate and pass therethrough to the acoustic sensing device.Type: ApplicationFiled: August 9, 2011Publication date: June 14, 2012Applicant: Industrial Technology Research InstituteInventors: Tzong-Che Ho, Chin-Fu Kuo, Hsin-Li Lee, Yao-Jung Lee, Li-Chi Pan
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Publication number: 20110297434Abstract: A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.Type: ApplicationFiled: May 20, 2011Publication date: December 8, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lung-Tai Chen, Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan
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Patent number: 7973454Abstract: A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.Type: GrantFiled: August 5, 2010Date of Patent: July 5, 2011Assignee: Industrial Technology Research InstituteInventors: Lung-Tai Chen, Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan
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Patent number: 7969016Abstract: A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface.Type: GrantFiled: November 28, 2007Date of Patent: June 28, 2011Assignee: Industrial Technology Research InstituteInventors: Jung-Tai Chen, Tzong-Che Ho, Chun-Hsun Chu
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Publication number: 20110150261Abstract: A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.Type: ApplicationFiled: December 21, 2009Publication date: June 23, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tzong-Che HO, Lung-Tai Chen, Yao-Jung Lee, Chao-Ta Huang, Li-Chi Pan, Yu-Sheng Hsieh
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Patent number: 7915065Abstract: A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.Type: GrantFiled: December 10, 2008Date of Patent: March 29, 2011Assignee: Industrial Technology Research InstituteInventors: Lung-Tai Chen, Chun-Hsun Chu, Tzong-Che Ho, Bor-Chen Tsai
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Publication number: 20110018075Abstract: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.Type: ApplicationFiled: October 2, 2009Publication date: January 27, 2011Inventors: Lung-Tai Chen, Yu-Wen Hsu, Sheah Chen, Jing-Yuan Lin, Li-Chi Pan, Tzong-Che Ho
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Publication number: 20090161901Abstract: An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.Type: ApplicationFiled: July 14, 2008Publication date: June 25, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tzong-Che Ho, Jason Pan, Pin Chang, Chin-Horng Wang, Jung-Tai Chen, Hsin-Li Lee, Kai-Hsiang Yen
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Patent number: RE43626Abstract: An LED lamp includes LED chips, an axle, and a lampshade. The LED chips are mounted on surface of the axle. The axle which is coupled to the lampshade includes heat pipes for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.Type: GrantFiled: August 18, 2010Date of Patent: September 4, 2012Assignee: Transpacific IP I Ltd.Inventors: Ra-Min Tain, Tzong-Che Ho, Shyi-Ching Liau