Abstract: A method for die attaching is disclosed. At first, at least one die and a die-attach preform are separately provided. The die-attach preform is picked and placed upon a die carrier. Then, the die is picked and placed upon the die-attach preform. The die and the die carrier are heated and clipped, so that the die-attach preform can adhere the die and the die carrier at the same time.

Abstract: A packaging process including the following steps is provided. First, a first substrate and a second substrate are provided. The first substrate has first contacts, and the second substrate has second contacts. Next, the first substrate is placed on the second substrate, such that the first contacts are aligned with the second contacts. Then, the first substrate and the second substrate are submerged in a solution having BDMT. After that, the first substrate and the second substrate are removed from the solution, such that self-assembly mono-layers are formed between the first substrate and the second substrate, to electrically connect the first substrate and the second substrate. A package structure formed according to the above process is also provided.

Abstract: A method for die attaching is disclosed. At first, at least one die and a die-attach preform are separately provided. The die-attach preform is picked and placed upon a die carrier. Then, the die is picked and placed upon the die-attach preform. The die and the die carrier are heated and clipped, so that the die-attach preform can adhere the die and the die carrier at the same time.

Abstract: A flip chip package structure includes a substrate, a chip, solder bumps, a heat sink, a thermal interface material (TIM), and solder balls. The substrate has an upper surface and a lower surface and further has a receiving area. The receiving area has a bottom in the substrate and an opening formed on the upper surface. Several solder bumps are disposed in the receiving area. The chip is disposed on the upper surface of the substrate, and covers the opening. The front surface of the chip is electrically coupled to the bottom via the solder bumps. The heat sink is attached to the upper surface of the substrate and the back surface of the chip through the adhesion of TIM. Several solder balls are disposed on the lower surface of the substrate.

Abstract: A chip package structure is disclosed. The chip package structure includes an inner molding compound with a low modulus covering the chip and an outer molding compound covering the inner molding compound. The outer molding compound has a modulus larger than then modulus of the inner molding compound.

Abstract: A semiconductor package includes a die attached to a substrate. Multitudes of conductive structures are conductively connected the die and the substrate. One molding compound encapsulates the die, and thermal interface material is on the molding compound. Next, a heat sink is on the thermal interface material. The mold compound material performs a coefficient of thermal expansion smaller than the heat sink so as to prevent the die or substrate from the damages of internal stresses.

Abstract: A chip package structure is disclosed. The chip package structure includes an inner molding compound with a low modulus and a heat sink covering the chip. An outer molding compound having a modulus larger than the modulus of the inner molding compound can be applied around the heat sink.

Abstract: A flip chip package structure includes a substrate, a chip, solder bumps, a heat sink, a thermal interface material (TIM), and solder balls. The substrate has an upper surface and a lower surface and further has a receiving area. The receiving area has a bottom in the substrate and an opening formed on the upper surface. Several solder bumps are disposed in the receiving area. The chip is disposed on the upper surface of the substrate, and covers the opening. The front surface of the chip is electrically coupled to the bottom via the solder bumps. The heat sink is attached to the upper surface of the substrate and the back surface of the chip through the adhesion of TIM. Several solder balls are disposed on the lower surface of the substrate.