Abstract: The present invention relates to a diaphragm, and stethoscopes provided with the same. The diaphragm having a plate-shaped vibratable portion, and the vibratable portion has a first surface. The diaphragm further comprises a compliant structural layer disposed on the first surface. When the diaphragm is assembled with a sound collecting head, the compliant structural layer is in contact with the sound collecting head to enhance the airtightness between the diaphragm and the sound collecting head to prevent the acoustic vibration energy from dissipating. The invention also relates to methods for manufacturing the diaphragm which can quickly produce a large number of diaphragms by simple processes.

Abstract: A protective case includes a first housing and a second housing. The first housing includes a first cavity portion and a first engaging portion. The first cavity portion has a first opening. The first engaging portion is connected to the first opening. The second housing includes a second cavity portion, a second engaging portion, and a bump. The second cavity portion has a second opening. The second engaging portion is connected to the second opening. The second engaging portion is detachably engaged with the first engaging portion, such that the first cavity portion and the second cavity portion form an accommodating space therebetween. The bump is connected to the second cavity portion and protrudes toward the second opening.

Abstract: The present disclosure provides a diaphragm set for a stethoscope having a chest piece. The diaphragm set includes a diaphragm having a bottom structure and a side structure connected to an edge of the bottom structure. The bottom structure and the side structure of the diaphragm form a diaphragm cavity for receiving the chest piece of the stethoscope.

Abstract: The present disclosure provides an auscultation device. The auscultation device comprises a sound capturing element, a chest piece holder, and a connecting structure. The chest piece holder is disposed on a distal end of the auscultation device, coupled to the sound capturing element, and includes a connecting structure. The chest piece comprises a dislocating structure removably coupled to the connecting structure of the chest piece holder.

Abstract: The present disclosure provides a stethoscope head assembly. The stethoscope head assembly comprises a diaphragm and a main body. The diaphragm comprises a membrane portion, and a sealing portion extending from a periphery of the membrane portion and comprising a ring-shaped raised platform and a connecting portion extending downwardly from a periphery of the ring-shaped raised platform. The main-body is detachably coupled to the diaphragm and comprises a sound gathering member. The connecting portion and the ring-shaped raised platform of the diaphragm cooperatively form a ring-shaped receiving slot for receiving the sound gathering member of the main body.

Abstract: A chip stack structure using conductive film bridge adhesive technology comprises a substrate, a first chip, at least one bridge element, a conductive film, and a second chip. The first chip is electrically connected to a first electrode of the substrate. The at least one bridge element has a first bridge surface and a second bridge surface at two ends, and the first bridge surface and the second bridge surface are electrically connected to the first chip and a second electrode of the substrate, respectively. The conductive film is electrically connected to the first bridge surface of the at least one bridge element. The second chip is stacked and electrically connected to the conductive film. Thus, the structure of the present invention not only facilitates the ease of stacking the chips but also increases the effectiveness of the chips heat dissipation and ability of withstanding electrical current.

Abstract: A copper clad laminate is disclosed to include a substrate defining a plurality of carrier zones for attachment of chips and having a plurality of barrier portions each arranged around at least one of the carrier zones for isolating the carrier zones. Thus, when tin sheets mounted between the chips and the carrier zones of the substrate become liquids in a thermal reflow process, the barrier portions of the substrate will stop an overflow of molten tin to prevent the chips from damage caused by a solder bridge problem.

Abstract: A copper clad laminate is disclosed to include a substrate defining a plurality of carrier zones for attachment of chips and having a plurality of barrier portions each arranged around at least one of the carrier zones for isolating the carrier zones. Thus, when tin sheets mounted between the chips and the carrier zones of the substrate become liquids in a thermal reflow process, the barrier portions of the substrate will stop an overflow of molten tin to prevent the chips from damage caused by a solder bridge problem.

Abstract: A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact.

Abstract: A chip stack structure using conductive film bridge adhesive technology comprises a substrate, a first chip, at least one bridge element, a conductive film, and a second chip. The first chip is electrically connected to a first electrode of the substrate. The at least one bridge element has a first bridge surface and a second bridge surface at two ends, and the first bridge surface and the second bridge surface are electrically connected to the first chip and a second electrode of the substrate, respectively. The conductive film is electrically connected to the first bridge surface of the at least one bridge element. The second chip is stacked and electrically connected to the conductive film. Thus, the structure of the present invention not only facilitates the ease of stacking the chips but also increases the effectiveness of the chips heat dissipation and ability of withstanding electrical current.

Abstract: A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact.

Abstract: The present invention discloses a mobile device including a motor module, a heat dissipation module, a vibration module and an electric brush module. The motor module has a rotating shaft driven by the motor module and two ends of which stick out from the motor module. The heat dissipation module includes a fan unit fixed on one end of the rotating shaft. The vibration module includes a vibration cam and an electromagnetic coil disposed on the vibration cam. The vibration cam is loosely fitted and disposed on the other end of the rotating shaft. The electric brush module is disposed inside the mobile device corresponding to the electromagnetic coil. When electrified, the electric brush module excites the electromagnetic coil generating a magnetic force to adhere and rotate with the rotating shaft synchronously. Herewith the effects of effective heat dissipation and saving interior space of the mobile device are achieved.

Abstract: The present invention discloses a mobile device including a motor module, a heat dissipation module, a vibration module and an electric brush module. The motor module has a rotating shaft driven by the motor module and two ends of which stick out from the motor module. The heat dissipation module includes a fan unit fixed on one end of the rotating shaft. The vibration module includes a vibration cam and an electromagnetic coil disposed on the vibration cam. The vibration cam is loosely fitted and disposed on the other end of the rotating shaft. The electric brush module is disposed inside the mobile device corresponding to the electromagnetic coil. When electrified, the electric brush module excites the electromagnetic coil generating a magnetic force to adhere and rotate with the rotating shaft synchronously. Herewith the effects of effective heat dissipation and saving interior space of the mobile device are achieved.

Abstract: A zoom lens and a zoom control method are disclosed. The zoom lens comprises an image sensing module, a plurality of lens sets, a plurality of reflecting mirrors, a plurality of rotation shafts. The image sensing module senses light beams to generate image signals. The plurality of lens sets respectively have different optical power. The plurality of reflecting minors comprise a movable reflecting mirror and a fixed reflecting minor. The plurality of rotation shafts are coupled the movable reflecting mirror. Therein, the movable reflecting minor is controlled by the plurality of rotation shafts to rotate to a first or a second position, such that the optical paths may be generated when the light beam passes through the lens sets having different optical power and each reflecting minor, and the light beam irradiates into the image sensing module through one of the optical paths.

Abstract: A height adjustment structure of printed circuit board and the adjustment method thereof are disclosed. The height adjustment structure includes an electronic device main body, a circuit board body and an adjusting component. The electronic device main body includes at least one fixing part. The circuit board body is disposed on a surface of the electronic device main body at which the fixing part is located. The circuit board body includes at least one stuck part, wherein the stuck part is disposed along the edge of the circuit board body and corresponds to the fixing part; further, the stuck part recesses inwards into the circuit board body to form a U shape. One end of the adjusting component movably penetrates the fixing part and being screw locked thereon, and another end of the adjusting component is embedded to the stuck part.

Abstract: A flashlight module adapted to be disposed on an image capturing device is provided. The image capturing device has a main body, a lens disposed on the main body and a lens ring disposed around the lens. The flashlight module includes a body and a flashlight. The body has a first end and a second end opposite to the first end, and the body is pivoted to the lens ring through the first end. The flashlight is disposed in the body. When the body is in a first status, the first end and the second end are adapted to be attached to the lens ring. When the body is in a second status, the second end is popped up to a predetermined distance.

Abstract: The present invention relates to a semiconductor device having a shielding layer. The semiconductor device includes a substrate, an inner metal layer, a shielding layer, an insulation material, a metal layer, a passivation layer and a redistribution layer. The inner metal layer is disposed in a through hole of the substrate. The shielding layer surrounds the inner annular metal. The insulation material is disposed between the inner metal layer and the shielding layer. The metal layer is disposed on a surface of the substrate, contacts the shielding layer and does not contact the inner metal layer. The redistribution layer is disposed in an opening of the passivation layer so as to contact the inner metal layer.

Abstract: The present invention relates to a semiconductor device having a shielding layer and a method for making the same. The semiconductor device includes a substrate, an inner metal layer, a shielding layer, an insulation material, a metal layer, a passivation layer and a redistribution layer. The inner metal layer is disposed in a through hole of the substrate. The shielding layer surrounds the inner annular metal. The insulation material is disposed between the inner metal layer and the shielding layer. The metal layer is disposed on a surface of the substrate, contacts the shielding layer and does not contact the inner metal layer. The redistribution layer is disposed in an opening of the passivation layer so as to contact the inner metal layer.

Abstract: An automatic photographing method with face recognition is applied in a camera having a detecting lens and a photographing lens for a user to photograph a target. First, detect a face of the user through the detecting lens, and obtain a plurality of face images of the detected face. Then, capture an image variance of the obtained face images, and photograph the target through a photographing lens when the captured image variance exceeds a photographing starting value. Therefore, during the whole photographing process, photographing can be achieved through determining variations of the face images of the user without pressing the shutter key of the camera, thereby completely preventing handshakes resulted from the pressing action, and thus improving the photographing quality.

Abstract: A charged coupled device (CCD) module fixed between a lens assembly and a main board having a first plate surface is disclosed. The CCD module comprises a hard PCB having a first surface and a second surface, a CCD component, and at least one fixed member. The first surface of the hard PCB faces the first plate surface of the main board. The CCD component facing the lens assembly is located on the second surface of the hard PCB. The fixed member is used for combining the hard PCB and the main board. The hard PCB and the fixed member can be used as a buffer to reduce possible damages to the CCD component and/or the main board.