Abstract: A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.

Abstract: Headphones having an ear cup rotatable from a first rest position to a second on position which functions to automatically activate a switch assembly to connect to a power source provided in the headphones. When the ear cup is moved from the first position to the second position, a movable post moves to operate a tactile switch provided in a circuit containing the power source. When the ear cup is moved from the second position to the first position, the circuit including the power source is open and the headphones no longer operate, thereby prolonging the life of the power source. A spring is associated with the ear cup to automatically return that ear cup to the first position when the headphones are removed from the head of a user.

Abstract: A docking station for connection between one or more portable electronic devices and an external device for networks. The docking station includes a docking surface having one or more connectors adapted to be connected to the portable electronic devices, the docking surface rotating with respect to a base section.