Patents by Inventor Tzu-kuei Wen

Tzu-kuei Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a chip package module with improve heat dissipation effect
    Patent number: 11145565
    Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: October 12, 2021
    Assignee: YOUNGTEK ELECTRONICS CORPORATION
    Inventors: Hsi-Ying Yuan, Tung-Chuan Wang, Chun-Yuan Hou, Ping-Lung Wang, Tzu-kuei Wen
  • CHIP PACKAGE MODULE WITH HEAT DISSIPATION FUNCTION AND MANUFACTURING METHOD THEREOF
    Publication number: 20210043532
    Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.
    Type: Application
    Filed: June 10, 2020
    Publication date: February 11, 2021
    Inventors: HSI-YING YUAN, TUNG-CHUAN WANG, CHUN-YUAN HOU, PING-LUNG WANG, Tzu-kuei Wen