Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

Abstract: A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer.

Abstract: The invention provides a method for fabricating a spacer fabric composite having a pattern, fabricating machine and composite fabricated by method thereof. The method comprises a film forming step, a patterning step, a laminating step and a hole opening step.

Abstract: A twistable light emitting diode display module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, and a plurality of light emitting diode devices. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer, where an edge of the insulating layer has an opening, located at an edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on sidewalls of the opening, and is connected to the electrode pattern layer. The plurality of light emitting diode devices are disposed on the circuit layer and are electrically connected to the circuit layer respectively, wherein each of the plurality of light emitting diode devices includes a driving circuit.

Abstract: The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).

Abstract: A twistable light emitting diode display module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, and a plurality of light emitting diode devices. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer, where an edge of the insulating layer has an opening, located at an edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on sidewalls of the opening, and is connected to the electrode pattern layer. The plurality of light emitting diode devices are disposed on the circuit layer and are electrically connected to the circuit layer respectively, wherein each of the plurality of light emitting diode devices includes a driving circuit.

Abstract: The invention provides a method for fabricating a spacer fabric composite having a pattern, fabricating machine and composite fabricated by method thereof. The method comprises a film forming step, a patterning step, a laminating step and a hole opening step.

Abstract: The invention provides a method for fabricating a spacer fabric composite, coating machine and composite fabricated by method thereof. The method comprises providing a resin composition, coating step and a hole opening step.

Abstract: The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).