Abstract: A three dimensional neural network accelerator that includes a first neural network accelerator tile that includes a first transmission coil, and a second neural network accelerator tile that includes a second transmission coil, wherein the first neural network accelerator tile is adjacent to and aligned vertically with the second neural network accelerator tile, and wherein the first transmission coil is configured to wirelessly communicate with the second transmission coil via inductive coupling.

Abstract: Components on an IC chip may operate faster or provide higher performance relative to power consumption if allowed access to sufficient memory resources. If every component is provided its own memory, however, the chip becomes expensive. In described implementations, memory is shared between two or more components. For example, a processing component can include computational circuitry and a memory coupled thereto. A multi-component cache controller is coupled to the memory. Logic circuitry is coupled to the cache controller and the memory. The logic circuitry selectively separates the memory into multiple memory partitions. A first memory partition can be allocated to the computational circuitry and provide storage to the computational circuitry. A second memory partition can be allocated to the cache controller and provide storage to multiple components.

Abstract: A three dimensional neural network accelerator that includes a first neural network accelerator tile that includes a first transmission coil, and a second neural network accelerator tile that includes a second transmission coil, wherein the first neural network accelerator tile is adjacent to and aligned vertically with the second neural network accelerator tile, and wherein the first transmission coil is configured to wirelessly communicate with the second transmission coil via inductive coupling.

Abstract: Methods, systems, and apparatus, including computer-readable media, are described for a hardware circuit configured to implement a neural network. The circuit includes multiple super tiles. Each super tile includes a unified memory for storing inputs to a neural network layer and weights for the layer. Each super tile includes multiple compute tiles. Each compute tile executes a compute thread that is used to perform the computations to generate an output for the neural network layer. Each super tile includes arbitration logic coupled to the unified memory and each compute tile. The arbitration logic is configured to: pass inputs stored in the unified memory to the compute tiles; pass weights stored in the unified memory to the compute tiles; and pass, to the unified memory, the output generated for the layer based on computations performed at the compute tiles using the inputs and the weights for the layer.

Abstract: Apparatus and methods for processing neural network models are provided. The apparatus can comprise a plurality of identical artificial intelligence processing dies. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies can include at least one inter-die input block and at least one inter-die output block. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies is communicatively coupled to another artificial intelligence processing die among the plurality of identical artificial intelligence processing dies by way of one or more communication paths from the at least one inter-die output block of the artificial intelligence processing die to the at least one inter-die input block of the artificial intelligence processing die.

Abstract: Apparatus and methods for processing neural network models are provided. The apparatus can comprise a plurality of identical artificial intelligence processing dies. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies can include at least one inter-die input block and at least one inter-die output block. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies is communicatively coupled to another artificial intelligence processing die among the plurality of identical artificial intelligence processing dies by way of one or more communication paths from the at least one inter-die output block of the artificial intelligence processing die to the at least one inter-die input block of the artificial intelligence processing die.

Abstract: Apparatus and methods for processing neural network models are provided. The apparatus can comprise a plurality of identical artificial intelligence processing dies. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies can include at least one inter-die input block and at least one inter-die output block. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies is communicatively coupled to another artificial intelligence processing die among the plurality of identical artificial intelligence processing dies by way of one or more communication paths from the at least one inter-die output block of the artificial intelligence processing die to the at least one inter-die input block of the artificial intelligence processing die.

Abstract: A three dimensional neural network accelerator that includes a first neural network accelerator tile that includes a first transmission coil, and a second neural network accelerator tile that includes a second transmission coil, wherein the first neural network accelerator tile is adjacent to and aligned vertically with the second neural network accelerator tile, and wherein the first transmission coil is configured to wirelessly communicate with the second transmission coil via inductive coupling.

Abstract: A three dimensional neural network accelerator that includes a first neural network accelerator tile that includes a first transmission coil, and a second neural network accelerator tile that includes a second transmission coil, wherein the first neural network accelerator tile is adjacent to and aligned vertically with the second neural network accelerator tile, and wherein the first transmission coil is configured to wirelessly communicate with the second transmission coil via inductive coupling.