Abstract: The present invention relates to a module of opto-electronic devices, which comprises a plurality of opto-electronic devices arranged on a first electrically insulating carrier substrate to define a plurality of interconnection regions between the opto-electronic devices, with each opto-electronic device comprising: —an upper device component that comprises a second electrically insulating carrier substrate and a counter electrode made of a metal, a conductive oxide or a conductive organic compound; —a lower device component that comprises a working electrode, a blocking layer, an active layer, a hole conducting layer and a lower contact layer, and —a conductive adhesive disposed between the upper device component and the lower device component, wherein the conductive adhesive disposed between the upper device component and the lower device component is a transparent conductive adhesive and an interconnecting conductive adhesive is provided in each interconnection region between, and in electrical contact wit