Patents by Inventor Ulrich Bos

Ulrich Bos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal process for applying hydrophilic layers to hydrophobic substrates for offset printing plates
    Patent number: 5967047
    Abstract: This invention relates to a process for preparing printing plates which are used in offset printing. The process produces a plate which comprises a substrate film in which a thin durable hydrophilic layer has been applied thereto. In the process, the substrate film is first microroughened by pressure blasting so that the surface roughness, R.sub.A, is in the range 0.3 to 1.5 .mu.m. Subsequently, a durable, firmly adhering hydrophilic layer is applied to substrate by plasma-spraying an oxide powder with a particle size of 1 to 40 .mu.m onto the substrate. This process produces a plate whose surface is not greasy or grainy.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: October 19, 1999
    Assignee: Agfa-Gevaert AG
    Inventors: Heinrich Kuhn, Dieter Jaculi, Engelbert Pliefke, Ulrich Bos, Werner Frass
  • Process for producing a strong bond between copper layers and ceramic
    Patent number: 5648123
    Abstract: The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of .ltoreq.20 .mu.m is applied to the ceramic surface by means of thermal spraying.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: July 15, 1997
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Heinrich Kuhn, Ulrich Bos, Carsten Hannss, Karl-Friedrich von Kayser