Patents by Inventor Ulrich Duellberg

Ulrich Duellberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8293320
    Abstract: The conductor, including the points being kept free insulation, is initially surrounded by a liquid, electrically non-conducting bonding agent which forms the insulation after solidifying. The conductor can be a transposed conductor in which the individual conductors thereof are electrically isolated relative to each other and are interconnected by the bonding agent. Using a liquid stripping agent based on a polyvinyl alcohol or a long-chain hydrocarbon mixture and a polysaccharide filler on the point of the conductor being kept free of the insulation locally prevents the bonding agent from bonding to the conductor or the individual conductors of the transposed conductor from being interconnected by means of the unsolidified mixture. Once the entire bonding agent is hard and thus the bonding agent/stripping agent mixture has solidified, the bonding agent/stripping agent mixture can easily be removed in a mechanical manner from the treated points of the conductor.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: October 23, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ivanka Atanasova-Hoehlein, Ulrich Duellberg, Peter Heinzig, Bogdan Kokotowski, Konrad Unterlugauer
  • Publication number: 20120076926
    Abstract: The conductor, including the points being kept free insulation, is initially surrounded by a liquid, electrically non-conducting bonding agent which forms the insulation after solidifying. The conductor can be a transposed conductor in which the individual conductors thereof are electrically isolated relative to each other and are interconnected by the bonding agent. Using a liquid stripping agent based on a polyvinyl alcohol or a long-chain hydrocarbon mixture and a polysaccharide filler on the point of the conductor being kept free of the insulation locally prevents the bonding agent from bonding to the conductor or the individual conductors of the transposed conductor from being interconnected by means of the unsolidified mixture. Once the entire bonding agent is hard and thus the bonding agent/stripping agent mixture has solidified, the bonding agent/stripping agent mixture can easily be removed in a mechanical manner from the treated points of the conductor.
    Type: Application
    Filed: December 7, 2011
    Publication date: March 29, 2012
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Ivanka ATANASOVA-HÖHLEIN, Ulrich DÜLLBERG, Peter HEINZIG, Bogdan KOKOTOWSKI, Konrad UNTERLUGAUER