Patents by Inventor Ulrich Hausch

Ulrich Hausch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10092766
    Abstract: One aspect is a capacitor, having a multitude of parallel insulator layers in one stack direction, made of an electrically non-conducting material, a multitude of conductor layers alternatingly stacked with the insulator layers in the direction of the stack made from a conductive material and at least one contact body. At least some of the conductor layers are connected to one another in a conductive manner via the contact body. The contact body extends through breaks form several insulator layers, where at least the insulator layers are made of a sintered material; the contact body is manufactured at least partially from a sintered material, which is introduced into the breaks in the insulator layers in an unsintered, malleable state.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: October 9, 2018
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Heiko Specht, Jacob Markham, Goran Pavlovic, Ulrich Hausch
  • Patent number: 9999777
    Abstract: One aspect generally relates to a composite, having a layer sequence. The layer sequence includes as layers a first layer, including a first ceramic, and first layer surface, a second layer, including a second ceramic, superimposing the first layer surface. The layer sequence includes a hole, connecting through each layer of the layer sequence; and a cermet. The cermet includes a first part and a second part. The first part is included by the hole. The second part is included between the first layer and the second layer. The cermet is in one piece.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 19, 2018
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ilias Nikolaidis, Frederik Roth, Ulrich Hausch
  • Publication number: 20180075952
    Abstract: One aspect relates to a component comprising i. a base body having a first component surface and a further component surface, the base body comprising a ceramic at least to an extent of 50 wt %, based on the total weight of the base body; ii. at least one electrical conduction element, the at least one electrical conduction element comprising a metal at least to an extent of 51 wt %, based on the electrical conduction element, and the at least one electrical conduction element passing through the entire base body from the first component surface to the further component surface; iii. at least one fastening element having a contact area, the at least one fastening element comprising a metal at least to an extent of 51 wt %, based on the fastening element, and the fastening element being surrounded at least in part by the base body.
    Type: Application
    Filed: February 19, 2016
    Publication date: March 15, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens TROETZSCHEL, Ulrich Hausch
  • Publication number: 20180071538
    Abstract: One aspect relates to a composite including a ceramic body, including a ceramic, a first surface, and a hole, including a front face, an end face and a lateral surface. The front face is an opening in the first surface. The ceramic body further includes a second surface and conductor a1. The conductor a1 electrically connects the second surface to the lateral surface, and includes a cermet.
    Type: Application
    Filed: August 17, 2017
    Publication date: March 15, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jean-Francois Fischer, Ulrich Hausch, Jens Troetzschel
  • Publication number: 20180050212
    Abstract: One aspect relates to an apparatus comprising a ceramic body including a first surface and a further surface. The first surface is opposite the further surface, the first surface includes a first opening. The further surface includes a further opening. The first opening and the further opening are connected by a tunnel, which at least partly includes a tunnel filling and is occluded by the tunnel filling. The tunnel filling includes a first constituent, including a cermet, and a second constituent. The first and second constituents are electroconductingly connected to one another. The first constituent has a first electrical conductivity and the second constituent has a second electrical conductivity, which differs from the first by at least 5·104 S/m. The ceramic body is characterized by a further electrical conductivity. The first electrical conductivity is more by at least 1·105 S/m than the further electrical conductivity.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 22, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ilias Nikolaidis, Frederik Roth, Ulrich Hausch, Robert Dittmer, Jacqueline Gebhardt, Sandra Sauer
  • Publication number: 20180050211
    Abstract: One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 22, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ulrich Hausch, Michael Schäfer, Jens Nachreiner
  • Publication number: 20180050210
    Abstract: One aspect generally relates to a composite, having a layer sequence. The layer sequence includes as layers a first layer, including a first ceramic, and first layer surface, a second layer, including a second ceramic, superimposing the first layer surface. The layer sequence includes a hole, connecting through each layer of the layer sequence; and a cermet. The cermet includes a first part and a second part. The first part is included by the hole. The second part is included between the first layer and the second layer. The cermet is in one piece.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 22, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ilias Nikolaidis, Frederik Roth, Ulrich Hausch
  • Patent number: 9855008
    Abstract: One aspect is an implantable medical device including a metal housing configured for implantation in a human and including a biocompatible metal and defining an opening. A feedthrough device is configured within the opening of the metal housing and includes an insulating section and a conducting section, the insulating section electrically isolating the conducting section from the metal housing. An ultrasonic joint is configured between the feedthrough device and metal housing that hermetically and mechanically bonds the feedthrough device and metal housing. The biocompatible metal of the housing is a microstructure primarily having ?-phase grains.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 2, 2018
    Assignee: Heraeus Deutschland GmbH & Co. LG
    Inventors: Jacob Markham, Ulrich Hausch
  • Patent number: 9849296
    Abstract: One aspect provides an implantable medical device with a housing having an opening with an opening width. A feedthrough is provided, including an insulator having a bottom surface and side surfaces and having an insulator width between opposing side surfaces that is greater than the opening width. A sinter joint is between at least one of the bottom surface, top surface, and side surfaces of the insulator and the housing which hermetically seals the insulator to the housing without an intervening ferrule.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: December 26, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Patent number: 9814891
    Abstract: One aspect provides a feedthrough device for an implantable medical device. The feedthrough includes a ferrule having a metal that is configured to be welded to a case of the implantable device. An insulator is substantially surrounded by the ferrule and shares an interface therewith, the insulator being a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze, solder, or weld joint at the interface between the ferrule and the insulator and that there is no braze or solder at interfaces between the insulator and the conductive elements.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: November 14, 2017
    Assignee: HERAEUS DUETSCHLAND GMBH & CO. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Publication number: 20170203106
    Abstract: One aspect provides an implantable medical device with a titanium housing having a flange defining a recess about an opening through the housing. The opening is disposed within the recess. A feedthrough is disposed within the recess with a gap between an insulator of the feedthrough and the flange. A braze joint is between the insulator and the flange that occupies the gap and hermetically seals the insulator to the housing. The braze joint includes a biocompatible gold alloy having a melting point less than the ?-transus temperature of the titanium of the housing.
    Type: Application
    Filed: March 29, 2017
    Publication date: July 20, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Publication number: 20170203107
    Abstract: One aspect provides an implantable medical device with a housing having an opening with an opening width. A feedthrough is provided, including an insulator having a bottom surface and side surfaces and having an insulator width between opposing side surfaces that is greater than the opening width. A sinter joint is between at least one of the bottom surface, top surface, and side surfaces of the insulator and the housing which hermetically seals the insulator to the housing without an intervening ferrule.
    Type: Application
    Filed: March 31, 2017
    Publication date: July 20, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Patent number: 9653893
    Abstract: One aspect is an implantable medical device with a feedthrough assembly having an insulator and a plurality of conducting elements extending therethrough. The feedthrough assembly is placed in a case with an opening defining a narrow space therebetween. A braze material fills the narrow space, thereby hermetically sealing the feedthrough assembly to the case. One of the feedthrough assembly and the case include a feature configured to securely hold the braze and in that the implantable medical device does not include a ferrule.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: May 16, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch, Goran Pavlovic
  • Publication number: 20170122373
    Abstract: The invention relates to a mechanical bearing containing a first component and a further component, wherein the mechanical bearing is designed such that the first component and the further component are able to execute a bearing movement relative to each other, wherein the first component or the further component contains a cermet or both contain a cermet. The invention further relates to an implantable medical device containing the mechanical bearing, in particular to a blood pump, and also to a use of a cermet for producing a mechanical bearing, and to a use of the mechanical bearing for supporting a component of an implantable medical device.
    Type: Application
    Filed: October 27, 2016
    Publication date: May 4, 2017
    Inventors: Jorg-Martin GEBERT, Ulrich HAUSCH, Stefan SCHIBLI
  • Publication number: 20170102001
    Abstract: One embodiment relates to a pump device with an impeller; a pump housing, including a wall surrounding an interior having an inlet and an outlet. The impeller is provided in the interior of the pump housing. The pump housing includes at least one first part-region, at least two further part-regions and at least one third part-region. The at least one first part-region includes, to an extent of at least 60% by weight, based on the total weight of the first part-region, at least one nonmagnetic material, wherein the at least two further part-regions comprise, to an extent of at least 25% by weight, based on the total weight of the further part-region, at least one ferromagnetic material metal, wherein the at least one third part-region comprises a metal content in a range from 40% to 90% by weight, based on the total weight of the third part-region.
    Type: Application
    Filed: March 23, 2015
    Publication date: April 13, 2017
    Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Stefan SCHIBLI, Jörg-Martin GEBERT, Ulrich HAUSCH, Oliver KEITEL
  • Patent number: 9610452
    Abstract: One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes applying a sinter paste onto a surface of the housing about a perimeter of an opening through the housing, the sinter paste including a biocompatible bonding material, and placing an insulator of the feedthrough onto the sinter paste so as to cover the opening. The sinter paste is then heated to a temperature less than a beta-transus temperature the titanium of the housing and to a temperature less than a melting point of the biocompatible bonding material for a desired duration to form, from the sinter paste, a sinter joint which bonds the feedthrough to the housing and hermetically seals the opening.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: April 4, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Patent number: 9610451
    Abstract: One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes providing the housing with a flange forming a recess about an opening through the housing, the opening disposed within the recess. A feedthrough is positioned within the recess so as to form a gap between the flange and an insulator of the feedthrough. A braze preform is then positioned within the recess about the insulator, the braze preform comprising a biocompatible braze material having a melting point less than a ?-transus temperature of the titanium of the housing. The preform is melted at a temperature less than the ?-transus temperature of the titanium of the housing such that the melted braze material fills at least the gap, and then cooled to form a braze joint which bonds the insulator to the housing and hermetically seals the opening.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: April 4, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Publication number: 20170071542
    Abstract: One aspect is an implantable medical device including a metal housing configured for implantation in a human and including a biocompatible metal and defining an opening. A feedthrough device is configured within the opening of the metal housing and includes an insulating section and a conducting section, the insulating section electrically isolating the conducting section from the metal housing. An ultrasonic joint is configured between the feedthrough device and metal housing that hermetically and mechanically bonds the feedthrough device and metal housing. The biocompatible metal of the housing is a microstructure primarily having ?-phase grains.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Publication number: 20160369813
    Abstract: One aspect of the invention relates to a pump device, comprising i. an impeller; ii. a pump housing which at least partly surrounds an interior region, having an inlet and an outlet, wherein the impeller is located within the interior region of the pump housing; wherein the pump housing comprises at least one first subregion and at least one further subregion; wherein the first subregion comprises a ceramic, wherein the further subregion comprises a metal, wherein at least one part of the first subregion and at least one part of the further subregion are connected to one another. One aspect of the invention further relates to a housing which comprises the features described for the pump housing. One aspect of the invention also relates to a method for producing a pump housing.
    Type: Application
    Filed: June 20, 2014
    Publication date: December 22, 2016
    Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Stefan SCHIBLI, Ulrich HAUSCH
  • Patent number: 9504841
    Abstract: One aspect provides a method of securing a feedthrough to a metal housing for an implantable medical device. The feedthrough is provided comprising an insulating section and at least one conductive section extending through the insulating section. At least a portion of the insulating section is metalized and the metalized feedthrough is placed within an opening in the metal housing of the implantable medical device. The feedthrough and metal housing are positioning within an ultrasonic welding system and the ultrasonic welding system is energized such that sonic energy welds the feedthrough directly to the metal housing. The temperature of the metal housing is not raised above the ?-transus temperature of the metal housing during the ultrasonic welding.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 29, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch