Abstract: A method for sampling an image sensor, the image sensor having a lattice structure having a plurality of triangular sensor elements. In the lattice structure, sensor elements situated adjacent to one another are configured to detect light having respectively different light properties. The method includes a step of reading out the image sensor by sampling a plurality of sensor elements of the lattice structure that are configured to detect light in a same first wavelength range, one sensor signal being read out per sensor element in the step of reading out. In addition, the method includes a step of buffering the read-out sensor signals and a step of producing an item of image information assigned to a point of acquisition of the image sensor, using the buffered sensor signals.

Abstract: A camera module, in particular for a vehicle, the camera module having at least: an objective having a lens mount and at least one lens, an image sensor for acquiring and converting optical signals into electrical signals, a bearer device on which the image sensor is mounted and contacted, and a camera housing for accommodating the objective and the bearer device. The objective is connected to the camera housing, in particular to a first housing part, and is borne by the camera housing. The bearer device can in particular be fixed on the objective or on the first housing part.

Abstract: A sensor module including at least one brightness sensor element for detecting a brightness of a wideband electromagnetic radiation and at least one color sensor field, which includes at least one color sensor element for detecting a color of the electromagnetic radiation. The brightness sensor element has a larger sensor surface than the color sensor field.

Abstract: An imager module for a vehicle camera, the imager module having at least: a lens holder, a lens accommodated in the lens holder, a flexible conductor device having leads, and an image sensor contacted by the leads of the flexible conductor device that has a front side having a sensitive surface; the image sensor being contacted by the leads using flip-chip technology via stud bumps provided at the front side thereof. The lens holder has a plastic part, in particular an injection-molded part, having a tubular region for accommodating the lens and a fastening region having a bottom side; and the flexible conductor device being integrally attached to the bottom side of the fastening region, and a non-conductive adhesive region being formed between the front side of the image sensor and the flexible conductor device around the stud bumps, preferably to produce a tensile stress. An insertion part is preferably received in the plastic body.

Abstract: A module device for a camera system having a housing device, which is provided with an inner opening and configured to allow an adjustment of an installation position of the module device in a motor vehicle; it also includes a sensor holder device which has an upper region and a base region, is coupled to the housing device via at least one support element and configured to accommodate an image sensor; a lens apparatus which is coupled to the sensor holder device in the upper region via at least one connection element and configured to generate an optical image on the image sensor; and a retaining spring device which is coupled to the housing device and the base region of the sensor holder device and is configured to press the image sensor against the sensor holder device.

Abstract: An image acquisition system, in particular for automotive applications, includes: a substrate; an image sensor mounted on the substrate and contacted via contact points; an optically transparent sealing compound that covers the image sensor, the contact points, and a portion of the upper substrate side; an optical device being arranged or secured in or on the sealing compound. The optical device can be placed into the sealing compound after shaping of the sealing compound or directly. Furthermore, the optical device can also be arranged directly by shaping the sealing compound. Manufacture of the image acquisition system can be incorporated into a board populating process.

Abstract: A sensor array including at least two image sensors situated one above the other in layers, including at least one organic semiconductor, and subdivided into pixels. The at least two image sensors are different in the size of their pixels.

Abstract: A mount for an objective housing. The mount includes a hollow space that is circular-cylindrical about an axis and has at least three receptacle protrusions for holding the objective housing, between which the hollow space arises and that are designed to hold the objective housing through clearance-free contact. The receptacle protrusions include at least two ribs that each have at least two regions having different extensions in the radial direction, relative to the axis.

Abstract: In a method for testing an image sensor having (i) regular pixels and test pixels, of which each is interconnected with one of two predefined voltage values, and (ii) a signal processing unit for providing digital signal values for output voltages of the pixels and test pixels, the following steps are performed: receiving digital signal values of the test pixels; and using the signal values of at least one proper or improper subset of the test pixels for testing the image sensor, all test pixels of the subset being interconnected with a first of the two voltage values. Using the test pixels for testing allows testing during ongoing operation, i.e., during reception of regular image signals.

Abstract: A camera, in particular for a vehicle, the camera having: an imager module which has a sensor carrier with a front side and a backside, an image sensor being fastened to the front side of the sensor carrier, an objective holder which is connected to the sensor carrier, and an objective which is accommodated in the objective holder, as well as a camera housing in which the imager module is accommodated. The camera housing has a front housing part including contact areas, at least one fixation means resting against the backside of the sensor carrier, and the imager module is fixated with respect to the contact areas and the fixation means is fastened to the front housing part by fastening means. In addition, a method for producing the camera is provided.

Abstract: A surroundings detection device for a vehicle includes a color sensor having a color pixel matrix and a monochrome sensor having a monochrome pixel matrix, the color sensor and the monochrome sensor being oriented to each other so that an object point of an object detectable by the color pixel matrix and the monochrome pixel matrix is projected onto a matrix point of the color pixel matrix and onto a matrix point of the monochrome pixel matrix which is offset with respect to the matrix point of the color pixel matrix by an offset value.

Abstract: An imager module for a camera includes: a lens holder; a lens system which is accommodated in the lens holder and has a lens mount and at least one lens accommodated in the lens mount; and an image sensor; a rear lens area being formed between the image sensor and the at least one lens of the lens system; and an optically transparent, flexible coupling element provided in the rear lens area.

Abstract: A camera module, in particular, for a vehicle, the camera module including at least: an objective mount and an objective, which is held in the objective mount and has a lens holder and at least one lens secured in the lens holder, the objective being fixed in position in the objective mount by a frictional connection between an outer surface of the lens holder and an inner surface of the objective mount. A plurality of frictional connection devices spaced apart in the circumferential direction are formed on the outer surface of the lens holder and/or on the inner surface of the objective mount, in order to generate the frictional connection. To insert and to adjust the objective, the objective mount is preferably asymmetrically deformed in an elastic manner, and the objective is placed into the deformed objective mount, and the elastic deformation is subsequently removed.

Abstract: A camera system for a vehicle includes: a camera housing; an imager module accommodated in the camera housing, the imager module including a carrier device, a lens accommodated in the carrier device, and an image sensor accommodated at the carrier device, an optical axis of the camera system being set by the image sensor and the lens. The image sensor makes contact with a metallic housing part of the camera housing via a heat-conducting element. The imager module is fixed in one direction perpendicular to the optical axis in the camera housing, i.e., it is braced in the radial direction and cooled axially toward the rear.

Abstract: A housing for mounting a component that includes an image sensor, a fixed installation space being provided in the interior of the housing for accommodating at least one optical component. The housing has at least one outer receiving recess that is spatially separate from the interior of the housing. This outer receiving recess is provided for receiving at least one positioning element in a way that allows the positioning element to define a support plane relative to the housing, and the component including the image sensor to be placed on the positioning element, so that the component including the image sensor resides in the defined support plane. In this case, the component including the image sensor may be placed in the defined support plane in a way that does not allow any direct contact between the component that includes the image sensor, and the housing.

Abstract: A camera for a vehicle, the camera including: an image sensor; and a camera lens system for imaging a coverage region on the image sensor; the camera lens system having at least one lens; and the camera lens system and the image sensor determining an optical axis of the camera. In this connection, The camera lens system further includes a nonplanar reflector element which deflects the optical axis of the camera.

Abstract: An image sensor module includes an image sensor bearer and an image sensor, the image sensor bearer being fashioned as an injection-molded circuit bearer, and the image sensor being situated on the image sensor bearer, and the image sensor bearer including at least one holding device that is integrally formed on the image sensor bearer.

Abstract: A camera assembly is provided for a vehicle, the camera assembly at least having: a camera having a camera optics and an image sensor, an optical coupling body including a contact face for engaging on an inner surface of a vehicle window pane; the optical coupling body being formed of an optically transparent material and being configured in an area of coverage by the camera; a fixing device being provided between the camera and the optical coupling body for positioning the coupling body relative to the camera.

Abstract: In a method for testing an image sensor having (i) regular pixels and test pixels, of which each is interconnected with one of two predefined voltage values, and (ii) a signal processing unit for providing digital signal values for output voltages of the pixels and test pixels, the following steps are performed: receiving digital signal values of the test pixels; and using the signal values of at least one proper or improper subset of the test pixels for testing the image sensor, all test pixels of the subset being interconnected with a first of the two voltage values. Using the test pixels for testing allows testing during ongoing operation, i.e., during reception of regular image signals.

Abstract: A camera system for a vehicle includes: a camera housing; an imager module accommodated in the camera housing, the imager module including a carrier device, a lens accommodated in the carrier device, and an image sensor accommodated at the carrier device, an optical axis of the camera system being set by the image sensor and the lens. The image sensor makes contact with a metallic housing part of the camera housing via a heat-conducting element. The imager module is fixed in one direction perpendicular to the optical axis in the camera housing, i.e., it is braced in the radial direction and cooled axially toward the rear.