Abstract: A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.

Abstract: A method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste, to a substrate by a dispensing operation, wherein the paste is applied in at least one strand.

Abstract: A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.

Abstract: A method for producing printing stencils, especially for screen printing methods, and particularly those for use in filling at least one contact hole formed in a printed-circuit board, a pattern artwork being reproduced on the stencil, which corresponds to an arrangement of contact holes on the printed-circuit board. It is provided that the pattern artwork reproduced on the stencil be produced in the same working process, especially a punching process, using a cluster punching tool, as the at least one contact hole on the printed-circuit board. Also, a stencil device is provided.

Abstract: In order to carry out simple, low-cost, uniform treatment of substrates, a device is provided for the processing of disk-shaped substrates, especially semiconductor wafers, comprising a substantially flat carrier ring, which can be rotated on a plane about an axis of rotation by means of a rotation device, and at least three support elements extending from the plane of the carrier ring, forming a multi-point support for the support at a distance from the plane of the carrier ring.

Abstract: The aim of the invention is to attain a uniform and homogeneous treatment of substrates in a device comprising at least one process container which is arranged in a gas atmosphere and which contains a treatment fluid. Said process container also comprises at least two openings which are located underneath a treatment fluid surface and through which the substrates are linearly guided. In addition, an overflow for the treatment fluid is provided.