Abstract: A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.

Abstract: A fan wheel comprises a hub and a plurality of blades extending radially outwardly from the hub. A ring is arranged in coaxial relationship with the hub and radially between the hub and the outside periphery of the fan wheel. The ring has a plurality of defined fixing positions distributed over the periphery thereof for mounting at least one balancing weight.

Abstract: A lead frame is configured with conductor leads, a dam bar and an extension between the conductor leads. The extension projects from the dam bar toward a central region of the lead frame. An electronic component is mounted on the lead frame and is brought into electrical contact with inner leads. The component and the lead frame are encased by injection molding. The extension is then isolated from the rest of the lead frame and is removed from the housing body. Thus a separating face is produced between the housing body and the extension. The separating face is used as a reference when positioning the component in a test socket.

Abstract: A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.

Abstract: A first casting mold region and a second casting mold region are brought together, with the result that a cavity, which is provided for receiving a leadframe and can be filled with a plastic molding compound, is formed. The first and second casting mold regions are brought together in such a way that at least a first contact region of the first casting mold region bears against a second contact region of the second casting mold region. The plastic package of the integrated circuit produced in this way has a smooth, burr-free surface, at least in the region of a centering portion. An integrated circuit having a lead frame and a plastic package and a test method for testing the integrated circuit are also provided.

Abstract: A composite member has at least two integrated electronic circuits (10, 210). Principal surfaces of the integrated electronic circuits (10, 210) are aligned substantially parallel to one another. The integrated electronic circuits (10, 210) have terminal lines (20, 20′, 30, 220′, 230) in the region of at least one of their boundary surfaces. The composite member is configured such that at least some of the terminal lines (20, 20′, 30) of one of the integrated electronic circuits (10) are directly connected to at least one terminal line (220′, 230) of another integrated electronic circuit (210). The method is for the manufacture of the composite member.

Abstract: A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention.