Patents by Inventor Umesh C. Desai
Umesh C. Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230279277Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.Type: ApplicationFiled: April 28, 2023Publication date: September 7, 2023Applicant: PPG Industries Ohio, Inc.Inventors: Tien-Chieh Chao, Masayuki Nakajima, Hongying Zhou, Shanti Swarup, Umesh C. Desai
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Patent number: 11674062Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.Type: GrantFiled: July 10, 2019Date of Patent: June 13, 2023Assignee: PPG Industries Ohio, Inc.Inventors: Tien-Chieh Chao, Masayuki Nakajima, Hongying Zhou, Shanti Swarup, Umesh C. Desai
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Patent number: 11629276Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: GrantFiled: March 11, 2021Date of Patent: April 18, 2023Assignee: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Publication number: 20220213362Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: ApplicationFiled: March 17, 2022Publication date: July 7, 2022Applicant: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Publication number: 20220204822Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Applicant: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Publication number: 20220204823Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Applicant: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Publication number: 20210198538Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: ApplicationFiled: March 11, 2021Publication date: July 1, 2021Applicant: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Patent number: 10947428Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: GrantFiled: December 7, 2015Date of Patent: March 16, 2021Assignee: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Publication number: 20190330502Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.Type: ApplicationFiled: July 10, 2019Publication date: October 31, 2019Applicant: PPG Industries Ohio, Inc.Inventors: Tien-Chieh Chao, Masayuki Nakajima, Hongying Zhou, Shanti Swarup, Umesh C. Desai
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Patent number: 10377928Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.Type: GrantFiled: December 10, 2015Date of Patent: August 13, 2019Assignee: PPG Industries Ohio, Inc.Inventors: Tien-Chieh Chao, Masayuki Nakajima, Hongying Zhou, Shanti Swarup, Umesh C. Desai
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Publication number: 20170166789Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.Type: ApplicationFiled: December 10, 2015Publication date: June 15, 2017Inventors: Masayuki Nakajima, Tien-Chieh Chao, Hongying Zhou, Shanti Swarup, Umesh C. Desai
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Patent number: 9562175Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.Type: GrantFiled: June 24, 2014Date of Patent: February 7, 2017Assignee: PPG Industries Ohio, Inc.Inventors: David B. Asay, Tien-Chieh Chao, Umesh C. Desai, Cheng-Hung Hung, Masayuki Nakajima, Noel R. Vanier
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Publication number: 20160153187Abstract: A laminated panel is disclosed that includes a first layer having an internal surface and an external surface, a second layer having an internal surface and an external surface, and a glue layer extending therebetween. The glue layer is produced from an aqueous dispersion of polymeric acrylic microparticles.Type: ApplicationFiled: December 1, 2014Publication date: June 2, 2016Inventors: Umesh C. Desai, Ion Pelinescu, Tien-Chieh Chao
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Publication number: 20160083633Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: ApplicationFiled: December 7, 2015Publication date: March 24, 2016Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
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Publication number: 20150284289Abstract: Embodiments of the present invention relate to sizing compositions for glass fibers, fiber glass strands, and composites reinforced with fiber glass strands. In one embodiment, a sizing composition for glass fibers comprises a polyether carbamate. In another embodiment, such sizing compositions further comprise an alkylsilane. In yet other embodiments, such sizing compositions further comprise an aminofunctional siloxane. In an embodiment of the present invention, a sizing composition for glass fibers comprises a polyether carbamate, an alkylsilane, and an aminofunctional siloxane.Type: ApplicationFiled: April 1, 2015Publication date: October 8, 2015Inventors: Pu Gu, James C. Watson, Langqiu Xu, Umesh C. Desai
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Patent number: 8877848Abstract: The present invention provides an aqueous polymer dispersion for vibration damping comprising a film-forming polymer in the form of dispersed particles comprising a polymer phase P1 and different polymer phases P2 and P3; the polymer dispersion obtained by free radical emulsion polymerization. Controlling the difference in glass transition temperatures of the polymers in the various polymer phases results in effective sound damping as determined by a Damping Loss Factor of at least 0.1 over a temperature range of at least 40° C. determined at a frequency of 200 Hz over a temperature range of ?10 to 65° C. Use of a chain transfer agent in the polymerization of the various monomer charges results in good appearance in the resultant vibration damping coating.Type: GrantFiled: July 26, 2013Date of Patent: November 4, 2014Assignee: PPG Industries Ohio, Inc.Inventors: Wei Wang, Tien-Chieh Chao, Umesh C. Desai, David Fenn
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Publication number: 20140299270Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.Type: ApplicationFiled: June 24, 2014Publication date: October 9, 2014Inventors: David B. Asay, Tien-Chieh Chao, Umesh C. Desai, Cheng-Hung Hung, Masayuki Nakajima, Noel R. Vanier
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Patent number: 8840962Abstract: The present invention is directed to a coating composition comprising: (i) an aqueous dispersion of polymeric particles; (ii) a polyether carbamate compound; (iii) a filler material; and (iv) an microparticle; and wherein after application to a substrate and after curing, the cured coating composition demonstrates a composite damping Loss Factor of 0.05 or greater at a frequency ranging from 100 to 6,300 Hz and comprises a surface that is substantially free of defects.Type: GrantFiled: May 14, 2010Date of Patent: September 23, 2014Assignee: PPG Industries Ohio, Inc.Inventors: Umesh C. Desai, Shanti Swarup, Kaliappa G. Ragunathan, Paul Pcolinsky
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Patent number: 8796361Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.Type: GrantFiled: May 3, 2012Date of Patent: August 5, 2014Assignee: PPG Industries Ohio, Inc.Inventors: David B. Asay, Tien-Chieh Chao, Umesh C. Desai, Cheng-Hung Hung, Masayuki Nakajima, Noel Vanier
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Publication number: 20140150970Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.Type: ApplicationFiled: June 14, 2013Publication date: June 5, 2014Inventors: Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan