Abstract: An air cooling arrangement for a column of integrated circuit modules is provided in which a pair of air moving devices are included, one located at the top and one at the bottom of the column each pulling air through the column. A heat sink having opposite side air outlets is attached to each of the modules and extends from the top side thereof. A cover plate having openings therein indexed with each of the heat sinks allows air to pass through the openings into the heat sinks. An air flow guide is located at each air outlet side of each heat sink and extends from the cover plate vertically into each heat sink to approximately the half way point to provide a vertical impinging air flow pattern which yields a high heat transfer coefficient. Air distribution ducts are arranged on opposite sides of the heat sinks parallel to the column and connected to the opposite side of air outlets of the heat sinks via air passages thereby providing a dividing of the flow across each heat sink.

Abstract: An improved conduction cooled module of the type having at least one chip mounted on a substrate and having a housing surrounding the chips and sealed to the substrate. The housing having cylinders therein opposite the chips for containing pistons which are resiliently urged against the chip surface. Each piston has an opening extending from the top to the bottom surface and has at least one circumferential groove located in the outer wall of the piston. The opening and circumferential grooves are preloaded with a low melt point heat conductive material which is reflowed after assembly into the module to fill the interfaces formed between the piston and chip and the piston and cylinder. Grooves are located in the piston walls forming the interfaces which facilitate the flow of the molten material into the interfaces.

Abstract: A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the heat generating components and on the same centers with respect thereto. A resilient member is located in the cap in communion with the inner end of the openings. A thermal conductive element is located in each of the openings forming a small peripheral gap between each opening wall and the associated thermal conductive element. The resilient member urges the thermal conductive elements into pressure contact with the heat generating components. A thermal conductive inert gas is located within the cap filling the peripheral gaps and the interfaces between the heat generating elements and the thermal conductive elements. The heat is removed from the cap by external heat removal means.