Abstract: Disclosed is a pogo pin including: a hollow body having a spring structure by spirally cutting at least a portion of an outer surface thereof; and a conductive material filling at least an inside of the body. According to the present invention, when testing a semiconductor package, error rate in contact between the package, the pogo pin and a test board can be remarkably reduced, and simultaneously can enhance rigidity and electrical conductivity of the pogo pin. Further, simple componentry of the pogo pin can facilitate its fabrication, reduce fabrication costs, and even foresee fabrication of a micro-pogo pin.

Abstract: Disclosed is a pogo pin including: a hollow body having a spring structure by spirally cutting at least a portion of an outer surface thereof; and a conductive material filling at least an inside of the body. According to the present invention, when testing a semiconductor package, error rate in contact between the package, the pogo pin and a test board can be remarkably reduced, and simultaneously can enhance rigidity and electrical conductivity of the pogo pin. Further, simple componentry of the pogo pin can facilitate its fabrication, reduce fabrication costs, and even foresee fabrication of a micro-pogo pin.

Abstract: The present invention relates to a stacked semiconductor package and a fabricating method thereof, wherein patterned conductor portions having a wiring function for changing the wiring of leads for controlling operations of stacked semiconductor chips are printed on surfaces of the semiconductor chips. According to the present invention, when the semiconductor chips are stacked one above another, the fabrication processes are simplified by eliminating use of a printed circuit board (PCB) with wiring formed therein for connecting the leads of the semiconductor chips to each other. Further, the connection between the leads can be made in various manners by using an electrically conductive ink or adhesive, so that the stacked semiconductor package can be easily fabricated.

Abstract: A test socket structure in which a contact pin of a defective socket is replaced by block unit, and a pattern of a printed circuit board of a testing equipment is not abraded during testing of a semiconductor device. A fabricating method of a contact pin is disclosed by which the contact pin is hardly deformed and its spring elastic force can be maintained for a long time.