Abstract: A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.

Abstract: A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.

Abstract: A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

Abstract: A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.

Abstract: A test device includes a test unit and a voltage selection circuit. The test unit is configured to detect a voltage at a test pad of a semiconductor device under test by applying a test current to the test pad. The voltage selection circuit is configured to apply a selection voltage to a ground pad of the semiconductor device under test by selecting one of a plurality of voltages according to a test mode.

Abstract: A test interface board includes an encoder, a signal copier, and a decoder. The encoder digitally encodes test data to generate a modulation signal. The signal copier copies the modulation signal by inductively coupling the modulation signal and outputs at least one copy signal corresponding to the modulation signal. The decoder decodes the modulation signal and the at least one copy signal in order to test at least two semiconductor devices.

Abstract: A test device includes a test unit and a voltage selection circuit. The test unit is configured to detect a voltage at a test pad of a semiconductor device under test by applying a test current to the test pad. The voltage selection circuit is configured to apply a selection voltage to a ground pad of the semiconductor device under test by selecting one of a plurality of voltages according to a test mode.

Abstract: A semiconductor device and a test apparatus including the same, the semiconductor device including a command distributor receiving a serial command that is synchronized with a first clock signal and converting the serial command into a parallel command, a command decoder receiving the parallel command and generating a pattern sequence based on the parallel command, and a signal generator receiving the pattern sequence and generating operating signals synchronized with a second clock signal, wherein a frequency of the first clock signal is less than a frequency of the second clock signal.

Abstract: A semiconductor device, which is mounted on a device interface board to interface an electrical measuring signal between automated test equipment (ATE) and a device under test (DUT), includes an AC test unit, a DC test unit, a first input/output (I/O) interface unit, and a second I/O interface unit. The AC test unit tests an AC characteristic of the DUT. The DC test unit provides a DC test path according to attributes of I/O terminals of the DUT. The first I/O interface unit selectively connects the AC test unit or the DC test unit to the ATE in response to a mode control signal. The second I/O interface unit selectively connects the AC test unit or the DC test unit to the DUT in response to the mode control signal.

Abstract: The driving apparatus of a display device calculates a slope using a minimum gray, a maximum gray, a gray average of frame data in a current frame, and a gray average of frame data in a previous frame, and corrects and outputs the input frame data according to the slope, using frame data of one frame. As a result, a gray range of the input image signal can be extended, thereby improving visibility. Further, in a case of a motion picture, even when a difference of a gray range of images of adjacent frames is large, an original image is not distorted due to extension of a gray range. Also, even when noise is included in the input image signal, a gray range can be extended after removing the noise.

Abstract: A semiconductor device and a test apparatus including the same, the semiconductor device including a command distributor receiving a serial command that is synchronized with a first clock signal and converting the serial command into a parallel command, a command decoder receiving the parallel command and generating a pattern sequence based on the parallel command, and a signal generator receiving the pattern sequence and generating operating signals synchronized with a second clock signal, wherein a frequency of the first clock signal is less than a frequency of the second clock signal.

Abstract: The driving apparatus of a display device calculates a slope using a minimum gray, a maximum gray, a gray average of frame data in a current frame, and a gray average of frame data in a previous frame, and corrects and outputs the input frame data according to the slope, using frame data of one frame. As a result, a gray range of the input image signal can be extended, thereby improving visibility. Further, in a case of a motion picture, even when a difference of a gray range of images of adjacent frames is large, an original image is not distorted due to extension of a gray range. Also, even when noise is included in the input image signal, a gray range can be extended after removing the noise.