Patents by Inventor Ung Jo MOON

Ung Jo MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing apparatus and method of controlling the same
    Patent number: 11901214
    Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 13, 2024
    Assignee: ZEUS CO., LTD.
    Inventors: Ji Ho Park, Woon Kong, Ung Jo Moon, Ki Hun Park
  • Wafer processing apparatus and wafer processing method
    Patent number: 11901212
    Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: February 13, 2024
    Assignee: ZEUS CO., LTD.
    Inventors: Woon Kong, Ji Hoon Song, Ung Jo Moon, Ji Ho Park, Won Seok Choi
  • WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
    Publication number: 20240038573
    Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 1, 2024
    Applicant: ZEUS CO., LTD.
    Inventors: Woon Kong, Ji Hoon SONG, Ung Jo MOON, Ji Ho PARK, Won Seok CHOI
  • WAFER PROCESSING APPARATUS AND METHOD OF CONTROLLING THE SAME
    Publication number: 20220310439
    Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 29, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Ji Ho PARK, Woon KONG, Ung Jo MOON, Ki Hun PARK
  • WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
    Publication number: 20220068696
    Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.
    Type: Application
    Filed: August 20, 2021
    Publication date: March 3, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Woon KONG, Ji Hoon SONG, Ung Jo MOON, Ji Ho PARK
  • WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
    Publication number: 20220068697
    Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
    Type: Application
    Filed: August 20, 2021
    Publication date: March 3, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Woon KONG, Ji Hoon SONG, Ung Jo MOON, Ji Ho PARK, Won Seok CHOI
  • WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
    Publication number: 20220068699
    Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.
    Type: Application
    Filed: August 20, 2021
    Publication date: March 3, 2022
    Applicant: ZEUS CO., LTD.
    Inventors: Woon KONG, Ji Hoon SONG, Ung Jo MOON, Ji Ho PARK, Won Seok CHOI