Patents by Inventor United Microelectronics Corporation

United Microelectronics Corporation has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130217234
    Abstract: A cleaning solution is provided. The cleaning solution includes an aliphatic polycarboxylic acid, a chain sulfonic acid substantially less than 4 wt % and an amine containing buffer agent.
    Type: Application
    Filed: March 21, 2013
    Publication date: August 22, 2013
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventor: UNITED MICROELECTRONICS CORPORATION
  • Publication number: 20130087810
    Abstract: A fin field-effect transistor structure comprises a substrate, a fin channel, a source/drain region, a high-k metal gate and a plurality of slot contact structures. The fin channel is formed on the substrate. The source/drain region is formed in the fin channel. The high-k metal gate formed on the substrate and the fin channel comprises a high-k dielectric layer and a metal gate layer, wherein the high-k dielectric layer is arranged between the metal gate layer and the fin channel. The slot contact structures are disposed at both sides of the metal gate.
    Type: Application
    Filed: November 29, 2012
    Publication date: April 11, 2013
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventor: UNITED MICROELECTRONICS CORPORATION
  • Publication number: 20130089957
    Abstract: A fin field-effect transistor structure includes a substrate, a fin channel and a high-k metal gate. The high-k metal gate is formed on the substrate and the fin channel. A process of manufacturing the fin field-effect transistor structure includes the following steps. Firstly, a polysilicon pseudo gate structure is formed on the substrate and a surface of the fin channel. By using the polysilicon pseudo gate structure as a mask, a source/drain region is formed in the fin channel. After the polysilicon pseudo gate structure is removed, a high-k dielectric layer and a metal gate layer are successively formed. Afterwards, a planarization process is performed on the substrate having the metal gate layer until the first dielectric layer is exposed, so that a high-k metal gate is produced.
    Type: Application
    Filed: December 3, 2012
    Publication date: April 11, 2013
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventor: UNITED MICROELECTRONICS CORPORATION
  • Publication number: 20130056297
    Abstract: A diaphragm of an MEMS electroacoustic transducer including a first axis-symmetrical pattern layer is provided. Because the layout of the first axis-symmetrical pattern layer can match the pattern of the sound wave, the vibration uniformity of the diaphragm can be improved.
    Type: Application
    Filed: November 1, 2012
    Publication date: March 7, 2013
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventor: United Microelectronics Corporation