Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.

Abstract: A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.

Abstract: A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.

Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.

Abstract: A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die.

Abstract: A method, apparatus and system are described for carbon nanotube wick structures. The system may include a frame and an apparatus. The apparatus may include a heat exchanger, a cold plate with a cold plate internal volume, and a heat pipe in the cold plate internal volume. In some embodiments, the heat pipe includes a thermally conductive wall material forming the inner dimensions of the heat pipe, a catalyst layer deposited onto the wall material, a carbon nanotube array formed on the catalyst layer, and a volume of working fluid. Other embodiments may be described.

Abstract: A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.

Abstract: A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die.