Patents by Inventor Urban MEDIC

Urban MEDIC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with low parasitic connection to passive device
    Patent number: 11973063
    Abstract: A semiconductor assembly includes a semiconductor package that includes first and second transistor dies embedded within a package body, the first and second transistor dies being arranged laterally side by side within the package body such that a first load terminal of the first transistor die faces an upper surface of the package body and such that a second load terminal of the second transistor die faces the upper surface of the package body, and a discrete capacitor mounted on the semiconductor package such that a first terminal of the discrete capacitor is directly over and electrically connected to the first load terminal of the first semiconductor die and such that a second terminal of the discrete capacitor is directly over and electrically connected with the second load terminal of the second semiconductor die.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: April 30, 2024
    Assignee: Infineon Technologies AG
    Inventors: Urban Medic, Eung San Cho, Tomasz Naeve
  • Semiconductor Package with Low Parasitic Connection to Passive Device
    Publication number: 20230017391
    Abstract: A semiconductor assembly includes a semiconductor package that includes first and second transistor dies embedded within a package body, the first and second transistor dies being arranged laterally side by side within the package body such that a first load terminal of the first transistor die faces an upper surface of the package body and such that a second load terminal of the second transistor die faces the upper surface of the package body, and a discrete capacitor mounted on the semiconductor package such that a first terminal of the discrete capacitor is directly over and electrically connected to the first load terminal of the first semiconductor die and such that a second terminal of the discrete capacitor is directly over and electrically connected with the second load terminal of the second semiconductor die.
    Type: Application
    Filed: July 19, 2021
    Publication date: January 19, 2023
    Inventors: Urban Medic, Eung San Cho, Tomasz Naeve
  • ELECTRONIC DEVICE WITH CASTELLATED BOARD
    Publication number: 20220377901
    Abstract: An electronic device is disclosed. In one example, the electronic device comprises a carrier board, a metal inlay having a cavity and being arranged in the carrier board. At least one electronic component is arranged at least partially in the cavity and embedded in the carrier board. Electric contacts are located at a castellated edge of the carrier board.
    Type: Application
    Filed: May 5, 2022
    Publication date: November 24, 2022
    Applicant: Infineon Technologies AG
    Inventors: Tomasz NAEVE, Urban MEDIC, Milad MOSTOFIZADEH, Petteri PALM