Patents by Inventor Urs Frick

Urs Frick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8955339
    Abstract: The invention relates to a device (21) for avoiding the memory effect in cryogenic pumps having a first cooling stage (23) and a second cooling stage (25) which adjoins the first cooling stage (23) in the axial direction. A cylindrical shield (31) has an opening (37) and a base (35), which base (35) is penetrated centrally by the two-stage cooling head (21) in such a way that the first cooling stage (23) is arranged outside the shield (31) and the second cooling stage (25) is arranged within the shield (31). An intermediate chamber (34) is formed between the shield (31) and the first cooling stage (23), and the base of the shield (31) is connected in a thermally conductive manner to the first cooling stage (23) by means of a thermal bridge (33). A cooling panel (43) which serves as pumping surface is connected to the second cooling stage (25) and is provided within the shield (31).
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: February 17, 2015
    Assignee: HSR AG
    Inventors: Marcel Kohler, Herbert Vogt, Urs Frick
  • Publication number: 20130104571
    Abstract: The invention relates to a device (21) for avoiding the memory effect in cryogenic pumps having a first cooling stage (23) and a second cooling stage (25) which adjoins the first cooling stage (23) in the axial direction. A cylindrical shield (31) has an opening (37) and a base (35), which base (35) is penetrated centrally by the two-stage cooling head (21) in such a way that the first cooling stage (23) is arranged outside the shield (31) and the second cooling stage (25) is arranged within the shield (31). An intermediate chamber (34) is formed between the shield (31) and the first cooling stage (23), and the base of the shield (31) is connected in a thermally conductive manner to the first cooling stage (23) by means of a thermal bridge (33). A cooling panel (43) which serves as pumping surface is connected to the second cooling stage (25) and is provided within the shield (31).
    Type: Application
    Filed: May 25, 2011
    Publication date: May 2, 2013
    Applicant: HSR AG
    Inventors: Marcel Kohler, Herbert Vogt, Urs Frick