Abstract: A chip assembly having a carrier having a cavity and at least one carrier contact, a chip arranged in the cavity and having at least one chip contact, and a wirebond wire, which electrically conductively connects the at least one chip contact to the at least one carrier contact, wherein the wirebond wire is flat-pressed in at least one subregion.

Abstract: The radiation applied to an object (input dose rate) during irradiation of the object by a radiation source (1) is limited during X-ray exposures. Pairs of values of a control curve which give rise to an input dose rate on the object to be examined which exceeds a predetermined maximum input dose rate are corrected by an arithmetic unit (76). This results in a corrected control curve whose entire length can be used for adjusting the desired tube parameters (tube voltage, tube current or load) without giving rise to the risk of exceeding the maximum input dose rate.

Abstract: The invention relates to a method and a device for limiting radiation applied to an object (input dose rate) during irradiation of the object by means of a radiation source (1), notably during X-ray exposures. Pairs of values of a control curve which give rise to an input dose rate on the object to be examined which exceeds a predetermined maximum input dose rate are corrected by means of a calculated factor. This results in a corrected control curve whose entire length can be used for adjusting the desired tube parameters (tube voltage, tube current or load) without giving rise to the risk of exceeding the maximum input dose rate.