Abstract: A micromechanical component, in particular a pressure sensor, including a substrate that has a membrane region, a surrounding region of the membrane region, at least one measuring resistance provided in the membrane region and modifiable by deformation of the membrane region, and a corresponding evaluation circuit provided in the surrounding region. An interference effect on the measuring resistance is producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit relative to the substrate. The invention also creates a corresponding equalization method on a test chip or as an individual final equalization.

Abstract: The invention creates a micromechanical component, in particular a pressure sensor, comprising: a substrate (2) that has a membrane region (10) and a surrounding region of the membrane region (10); at least one measuring resistance (4a, 4b; 41, 42) provided in the membrane region (10) and modifiable by deformation of the membrane region (10); a corresponding evaluation circuit (50) provided in the surrounding region, an interference effect on the measuring resistance (4a, 4b; 41, 42) being producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit (50) relative to the substrate (2); and at least one patch (60; 70, 70′) provided in the surrounding region and/or in the membrane region (10) and made of a material such that by way of a deformation of the patch or patches (60) relative to the substrate (2), an analog interference effect can be generated in such a way that the interference effect acting on the measuring resistance (4a, 4b; 41, 42) can be compensated

Abstract: A device for detecting the pressure and the temperature in the intake tube of an internal combustion engine, including a temperature sensor, a pressure sensor and a substrate each of which are secured in a housing with as little stress as possible with the pressure sensor secured on a substrate together with an evaluation circuit. The temperature sensor measures precise temperature measurement. In order to introduce a fluid medium that is under pressure, a neck part is secured to the housing and an adapter is joined both to the substrate and to the neck part via adhesive seals that decouple mechanical stress from the pressure and temperature detectors.

Abstract: A semiconductor chip, which is preferably designed as a pressure sensor, has on its rear side one or more depressions in which the pressure is measured by correspondingly designed diaphragms which are coupled to piezosensitive circuits. The surface of the depressions and, optionally, the rear side of the semiconductor chip are coated with a protective layer which ensures that the semiconductor is protected from aggressive media. The protective layer thereby makes it possible to use the sensor universally in acids, lyes or hot gases.

Abstract: An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.

Abstract: In a pressure sensor, a force is transferred via a pressure plunger end made of relatively hard material onto a measurement element including a sensor membrane on a support. The sensor membrane is part of a micromechanical arrangement made of silicon. A metal structure made of a metal of lower hardness compared with the hardness of the material of the pressure plunger end is applied onto the sensor membrane. This metal structure can be impressed and plastically deformed with increased force by the contact surface of the pressure plunger end, in such a way that conforming contact of the contact surface is achieved, and potential angular errors are compensated for.