Abstract: A semiconductor device module includes an application board, a plurality of semiconductor device packages disposed on the application board, each one of the semiconductor device packages including a semiconductor die, a leadframe including a plurality of leads, the leads including a spring support and a heat dissipation element, and an encapsulant embedding the semiconductor die and first portions of the leads, an external heatsink, and one or more thermally conductive interface layers disposed between the semiconductor device package and the heatsink.

Abstract: A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.

Abstract: An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

Abstract: An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

Abstract: A connector module (31, 71) has a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72) to be positioned into a depression (36) in the base body, a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73). The base body (21) and the molded part (33) form two jaws for gripping the fiber (73).

Abstract: Connector module and method of manufacturing same A connector module (31, 71) comprises a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72), a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73).

Abstract: A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Abstract: The present invention relates to a navigation apparatus and a method for outputting navigation instructions. The navigation apparatus comprises a navigation unit (2), a position determination apparatus, a processor apparatus having an operating memory, a mass memory apparatus for receiving a data bank, a display apparatus, an operating element configuration, a sound output apparatus, and navigation software. The present invention is distinguished in that the display apparatus and operating element configuration are situated separately in a mobile multimedia playback device (1). The present invention allows a combination of the two separate device and service species “navigation” and “personal multimedia” by expanding the area of use of multimedia playback devices and associated provider services to the field of navigation. The operating interface familiar to the user and the familiar access to the data and services of the service provider are also maintained for the new area of application of navigation.

Abstract: A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Abstract: In an undulator for the generation of synchrotron radiation from a particle beam introduced into the undulator, two partial undulators are provided each comprising a conductor of superconductive material which, when a current is conducted therethrough, generates an undulator field that extends perpendicularly to the current flow, and the superconductive conductors are arranged in the individual partial undulators such that the undulator fields generated are not parallel, whereby, by controlling the energization of the two partial undulators, the polarization direction of the synchrotron radiation can be adjusted without mechanical movements.

Abstract: The invention relates to a tension-relief attachment for multiple cables, especially flat-ribbon cables, having a bearing wall (11) which is provided with parallel bearing troughs (15), and having an abutment part (3) which presses the cable wires (19) against the bearing troughs (15) of the bearing wall (11). A base plate (5) is provided out of whose top the bearing wall (11) projects upwards, the bearing troughs, which are in the form of shells, being seated on the top (9) of the base plate (5) and extending from there to the upper edge (17) of the bearing wall (11). Furthermore, an abutment wall (27) is provided which can be pressed against the bearing wall (11) and is provided with bearing troughs (29) which are in mirror-image form and are in the form of shells, each of which is allocated to a bearing trough (15) of the bearing wall (11).

Abstract: In an undulator for the generation of synchrotron radiation from a particle beam introduced into the undulator, two partial undulators are provided each comprising a conductor of superconductive material which, when a current is conducted therethrough, generates an undulator field that extends perpendicularly to the current flow, and the superconductive conductors are arranged in the individual partial undulators such that the undulator fields generated are not parallel, whereby, by controlling the energization of the two partial undulators, the polarization direction of the synchrotron radiation can be adjusted without mechanical movements.

Abstract: The invention concerns a carrier (10) for the production and optionally the transport of cable harnesses (1) or parts of cable harnesses that are formed at least partially from ribbon cables.