Patents by Inventor Vadim Gektin
Vadim Gektin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10418829Abstract: A device includes a charger case. Charging electronics are supported within the case. An electrical connector is coupled to the charging electronics for coupling to a power source. A cooling element is coupled to the charger case and extendable to an extended position from the case such that a cooling surface area of the charger case is increased.Type: GrantFiled: January 18, 2017Date of Patent: September 17, 2019Assignee: Futurewei Technologies, Inc.Inventors: Vadim Gektin, Quanming Li, Guo Yang
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Patent number: 10292308Abstract: A fluid coupling mating apparatus and method. Included is at least one mating member for removably coupling with another mating member for allowing fluid to pass therebetween. A lock is movably coupled to the at least one mating member. Still yet, a holder is coupled to the lock for holding the lock in relation to the holder during at least a portion of the removable coupling of the at least one mating member with another mating member.Type: GrantFiled: July 28, 2015Date of Patent: May 14, 2019Assignee: Futurewei Technologies, Inc.Inventors: Mo Bai, Vadim Gektin
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Patent number: 10117357Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.Type: GrantFiled: July 20, 2015Date of Patent: October 30, 2018Assignee: FUTUREWEI TECHNOLOGIES, INC.Inventors: Mo Bai, Vadim Gektin
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Publication number: 20180205245Abstract: A device includes a charger case. Charging electronics are supported within the case. An electrical connector is coupled to the charging electronics for coupling to a power source. A cooling element is coupled to the charger case and extendable to an extended position from the case such that a cooling surface area of the charger case is increased.Type: ApplicationFiled: January 18, 2017Publication date: July 19, 2018Inventors: Vadim Gektin, Quanming Li, Guo Yang
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Patent number: 9851520Abstract: An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.Type: GrantFiled: April 22, 2016Date of Patent: December 26, 2017Inventors: Vadim Gektin, Xing Fu, Chengpeng Yang
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Patent number: 9813082Abstract: A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.Type: GrantFiled: October 8, 2015Date of Patent: November 7, 2017Assignee: FUTUREWEI TECHNOLOGIES, INC.Inventors: Mo Bai, Vadim Gektin
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Publication number: 20170307837Abstract: An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.Type: ApplicationFiled: April 22, 2016Publication date: October 26, 2017Inventors: Vadim Gektin, Xing Fu, Chengpeng Yang
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Publication number: 20170104500Abstract: A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.Type: ApplicationFiled: October 8, 2015Publication date: April 13, 2017Inventors: Mo Bai, Vadim Gektin
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Publication number: 20170030497Abstract: A fluid coupling mating apparatus and method are provided. Included is at least one mating member for removably coupling with another mating member for allowing fluid to pass therebetween. A lock is movably coupled to the at least one mating member. Still yet, a holder is coupled to the lock for holding the lock in relation to the holder during at least a portion of the removable coupling of the at least one mating member with another mating member.Type: ApplicationFiled: July 28, 2015Publication date: February 2, 2017Applicant: FUTUREWEI TECHNOLOGIES, INC.Inventors: Mo Bai, Vadim Gektin
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Publication number: 20170027083Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.Type: ApplicationFiled: July 20, 2015Publication date: January 26, 2017Inventors: Mo Bai, Vadim Gektin
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Patent number: 9241421Abstract: The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling air is circulated to the line cards. One technique for centrally locating the LC-to-CP interfaces on the connection plane is to invert one column of line cards. Another technique for centrally locating the LC-to-CP interfaces on the connection plane is to use non-uniform line cards. An additional benefit of centrally locating the LC-to-CP interfaces on the connection plane is that the inter-LC channels extending between perpendicularly adjacent line cards are shortened, which increases server performance by virtue of reducing switching latency.Type: GrantFiled: July 31, 2013Date of Patent: January 19, 2016Assignee: Futurewei Technologies, Inc.Inventors: Vadim Gektin, Jiye Xu
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Patent number: 9196564Abstract: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.Type: GrantFiled: April 17, 2013Date of Patent: November 24, 2015Assignee: Futurewei Technologies, Inc.Inventors: Vadim Gektin, Youlin Jin
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Publication number: 20150036280Abstract: The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling air is circulated to the line cards. One technique for centrally locating the LC-to-CP interfaces on the connection plane is to invert one column of line cards. Another technique for centrally locating the LC-to-CP interfaces on the connection plane is to use non-uniform line cards. An additional benefit of centrally locating the LC-to-CP interfaces on the connection plane is that the inter-LC channels extending between perpendicularly adjacent line cards are shortened, which increases server performance by virtue of reducing switching latency.Type: ApplicationFiled: July 31, 2013Publication date: February 5, 2015Applicant: FutureWei Technologies, Inc.Inventors: Vadim Gektin, Jiye Xu
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Publication number: 20140332948Abstract: Lower semiconductor dies in 2.5 D semiconductor packaging configurations can be cooled by thermally coupling the lower semiconductor dies to a heat sink positioned above the interposer, to an upper semiconductor die, to a heat sink affixed beneath a substrate, or to free-flowing air circulating above the interposer or beneath the substrate. The thermal coupling can be achieved using heat pipes, thermal vias, or other conductive passage ways.Type: ApplicationFiled: May 10, 2013Publication date: November 13, 2014Applicant: FutureWei Technologies, Inc.Inventors: Anwar A. Mohammed, Vadim Gektin
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Patent number: 8884425Abstract: Lower semiconductor dies in 2.5 D semiconductor packaging configurations can be cooled by thermally coupling the lower semiconductor dies to a heat sink positioned above the interposer, to an upper semiconductor die, to a heat sink affixed beneath a substrate, or to free-flowing air circulating above the interposer or beneath the substrate. The thermal coupling can be achieved using heat pipes, thermal vias, or other conductive passage ways.Type: GrantFiled: May 10, 2013Date of Patent: November 11, 2014Assignee: FutureWei Technologies, Inc.Inventors: Anwar A. Mohammed, Vadim Gektin
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Publication number: 20140262449Abstract: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.Type: ApplicationFiled: April 17, 2013Publication date: September 18, 2014Applicant: FutureWei Technologies, Inc.Inventors: Vadim Gektin, Youlin Jin
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Patent number: 8767391Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.Type: GrantFiled: August 27, 2012Date of Patent: July 1, 2014Assignee: Futurewei Technologies, Inc.Inventors: Youlin Jin, Jiye Xu, Vadim Gektin
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Publication number: 20140055951Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.Type: ApplicationFiled: August 27, 2012Publication date: February 27, 2014Applicant: FUTUREWEI TECHNOLOGIES, INC.Inventors: Youlin Jin, Jiye Xu, Vadim Gektin
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Patent number: 8368205Abstract: A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.Type: GrantFiled: December 17, 2010Date of Patent: February 5, 2013Assignee: Oracle America, Inc.Inventors: Seshasayee Ankireddi, Vadim Gektin, James A. Jones, Margaret B. Stern
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Patent number: 8331094Abstract: A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.Type: GrantFiled: January 24, 2011Date of Patent: December 11, 2012Assignee: Oracle International CorporationInventors: Seshasayee Ankireddi, Vadim Gektin