Abstract: An organic light emitting device is provided having an emissive layer with an internal interface. The concentration of a second phosphorescent material in a second organic layer is different from the concentration of a first phosphorescent material in a first organic layer, creating the interface. The materials in the first and second organic layers may be the same or different. In addition to this interface within the emissive layer, the device has one or more features designed to mitigate failure mechanisms which may be associated with electrons or excitons passing from the cathode through the emissive layer to damage organic layers on the anode side of the emissive layer. In addition, devices are provided having an interface within the emissive layer as described above, and a lower energy emissive material on at least one side of the interface.

Abstract: An organic light emitting device is provided having an emissive layer with an internal interface. The concentration of a second phosphorescent material in a second organic layer is different from the concentration of a first phosphorescent material in a first organic layer, creating the interface. The materials in the first and second organic layers may be the same or different. In addition to this interface within the emissive layer, the device has one or more features designed to mitigate failure mechanisms which may be associated with electrons or excitons passing from the cathode through the emissive layer to damage organic layers on the anode side of the emissive layer. In addition, devices are provided having an interface within the emissive layer as described above, and a lower energy emissive material on at least one side of the interface.

Abstract: Methods for evaporating (e.g., subliming) a material in the solid state. In one aspect, a mass of the material in the solid state is mixed with a plurality of packing units, wherein each of the packing units comprises an inert material. The structure of each of the packing units, or the structure of an aggregate of the packing units, comprises a plurality of non-smooth features. In one example, Pro-Pak™ metal meshes can be used, which have a plurality of various types of non-smooth features, including sharp edges, corners, and/or protrusions. These non-smooth features are believed to physically disrupt crust formation during the evaporation process. Also disclosed are other methods for evaporating a material and methods for fabricating an organic thin-film device.