Patents by Inventor Valerie A. Oberson
Valerie A. Oberson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8197612Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.Type: GrantFiled: April 29, 2008Date of Patent: June 12, 2012Assignee: International Business Machines CorporationInventors: James A Busby, Minhua Lu, Valerie A Oberson, Eric D Perfecto, Kamalesh K Srivastava, Brian R Sundlof, Julien Sylvestre, Renee L Weisman
-
Publication number: 20120083113Abstract: A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.Type: ApplicationFiled: September 30, 2010Publication date: April 5, 2012Applicant: International Business Machines CorporationInventors: Charles L. Arvin, Valerie Oberson, Srinivasa N. Reddy, Krystyna W. Semkow, Richard A. Shelleman, Kamalesh K. Srivastava
-
Patent number: 8003512Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.Type: GrantFiled: February 3, 2009Date of Patent: August 23, 2011Assignee: International Business Machines CorporationInventors: Luc L. Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie A. Oberson, Da-Yuan Shih
-
Patent number: 7780801Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.Type: GrantFiled: July 26, 2006Date of Patent: August 24, 2010Assignee: International Business Machines CorporationInventors: Eric Duchesne, Kang-Wook Lee, Valerie Oberson
-
Publication number: 20100193949Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.Type: ApplicationFiled: February 3, 2009Publication date: August 5, 2010Applicant: International Business Machines CorporationInventors: Luc L. Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie A. Oberson, Da-Yuan Shih
-
Publication number: 20100175790Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.Type: ApplicationFiled: March 25, 2010Publication date: July 15, 2010Applicant: International Business Machines CorporationInventors: Eric Duchesne, Kang-Wook Lee, Valerie Oberson
-
Patent number: 7740713Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.Type: GrantFiled: April 28, 2004Date of Patent: June 22, 2010Assignee: International Business Machines CorporationInventors: Eric Duchesne, Michael Gaynes, Timothy A. Gosselin, Kang-Wook Lee, Valerie Oberson
-
Publication number: 20090266447Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES A. BUSBY, MINHUA LU, VALERIE A. OBERSON, ERIC D. PERFECTO, KAMALESH K. SRIVASTAVA, BRIAN R. SUNDLOF, JULIEN SYLVESTRE, RENEE L. WEISMAN
-
Publication number: 20090039142Abstract: A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
-
Publication number: 20090039140Abstract: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
-
Publication number: 20080124568Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.Type: ApplicationFiled: July 26, 2006Publication date: May 29, 2008Inventors: Eric Duchesne, Kang-Wook Lee, Valerie Oberson
-
Patent number: 7332424Abstract: Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.Type: GrantFiled: February 1, 2005Date of Patent: February 19, 2008Assignee: International Business Machines CorporationInventors: Luc Bélanger, Peter A. Gruber, Valérie Oberson, Christopher L. Tessler
-
Publication number: 20060035454Abstract: Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.Type: ApplicationFiled: February 1, 2005Publication date: February 16, 2006Applicant: IBM CorporationInventors: Luc Belanger, Peter Gruber, Valerie Oberson, Christopher Tessler
-
Publication number: 20050263571Abstract: A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.Type: ApplicationFiled: May 30, 2004Publication date: December 1, 2005Inventors: Luc Belanger, Guy Brouillette, Stephen Buchwalter, Peter Gruber, Hideo Kimura, Jean-Luc Landreville, Frederic Manurer, Marc Montminy, Valerie Oberson, Da-Yuan Shih, Stephane St-Onge, Michel Turgeon, Takeshi Yamada
-
Publication number: 20050241731Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.Type: ApplicationFiled: April 28, 2004Publication date: November 3, 2005Applicant: International Business Machines CorporationInventors: Eric Duchesne, Michael Gaynes, Timothy Gosselin, Kang-Wook Lee, Valerie Oberson