Patents by Inventor Valerie Chen

Valerie Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944784
    Abstract: Disclosed herein are combined devices and methods of manufacturing such combined devices. The combined devices disclosed herein include an analyte sensor including a sensor probe; an infusion set hub including a cannula; and a flexible base. The analyte sensor and infusion set hub are attached to the flexible base such that movement of one of the analyte sensor and the infusion set hub is substantially not transferred to the other one of the analyte sensor and the infusion set hub.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: April 2, 2024
    Assignee: Medtronic Minimed, Inc.
    Inventors: Guangping Zhang, Kiem H. Dang, Valerie Chen, Ling Jiang, Evan Anselmo, Zhiwu Fang, Sarnath Chattaraj
  • Publication number: 20210146047
    Abstract: Disclosed herein are combined devices and methods of manufacturing such combined devices. The combined devices disclosed herein include an analyte sensor including a sensor probe; an infusion set hub including a cannula; and a flexible base. The analyte sensor and infusion set hub are attached to the flexible base such that movement of one of the analyte sensor and the infusion set hub is substantially not transferred to the other one of the analyte sensor and the infusion set hub.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 20, 2021
    Inventors: Guangping Zhang, Kiem H. Dang, Valerie Chen, Ling Jiang, Evan Anselmo, Zhiwu Fang, Sarnath Chattaraj
  • Publication number: 20140370223
    Abstract: A double coated tape including a glass cloth carrier, a pressure sensitive adhesive layer on each side of the carrier, and a porous release liner. The pressure sensitive adhesive leaves no residue property on Stainless and Copper panel after 300° C.×15 minute with 5 minute cooling. A method of forming a double sided adhesive tape including: providing a porous carrier having a first surface and a second surface; applying a first pressure sensitive adhesive on the first surface of the porous carrier, curing the first pressure sensitive adhesive to form a first pressure sensitive adhesive layer, laminating a porous release liner on the first pressure sensitive adhesive layer, applying a second pressure sensitive adhesive on the second surface of the porous carrier; and curing the second pressure sensitive adhesive to form a second pressure sensitive layer.
    Type: Application
    Filed: June 12, 2014
    Publication date: December 18, 2014
    Applicants: NITTO DENKO CORPORATION, NITTO DENKO AUTOMOTIVE NEW JERSEY, INC., NITTO DENKO AMERICA, INC.
    Inventors: Yu-chu (Valerie) CHEN, Masatoshi SUZUKI