Abstract: Three dimensional printing equipment and techniques may be used in combination with three dimensional design data associated with well drilling equipment and well completion equipment to form molds associated with manufacture of such equipment. For example, such molds may be used to form a bit body or other components associated with a rotary drill bit. For some applications composite or matrix materials may be placed in the mold to form a matrix bit body. Heat transfer characteristics of the mold may be optimized for heating and/or cooling of the matrix materials to provide optimum fracture resistant (toughness) and optimum erosion, abrasion and/or wear resistance for portions of the bit body. Such molds may also be used to form steel bit bodies associated with fixed cutter rotary drill bits and other components associated with a wide variety of well drilling equipment and well completion equipment.

Abstract: Three dimensional printing equipment and techniques may be used in combination with three dimensional design data associated with well drilling equipment and well completion equipment to form molds associated with manufacture of such equipment. For example, such molds may be used to form a bit body or other components associated with a rotary drill bit. For some applications composite or matrix materials may be placed in the mold to form a matrix bit body. Heat transfer characteristics of the mold may be optimized for heating and/or cooling of the matrix materials to provide optimum fracture resistant (toughness) and optimum erosion, abrasion and/or wear resistance for portions of the bit body. Such molds may also be used to form steel bit bodies associated with fixed cutter rotary drill bits and other components associated with a wide variety of well drilling equipment and well completion equipment.

Abstract: The invention relates to a circuit arrangement comprising an SMD-component (1), in particular a temperature sensor with a thermistor element (1), having two electroconductive contacts (2a, 2b), which are each conductively connected to a conductor track (3a, 3b) provided on a substrate (4). A firm, mechanical connection as well as a good electroconductive connection between the SMD-component and the conductor tracks is achieved in that the contacts (2a, 2b) are each made of a metal-glass layer (6) forming the connection to the conductor tracks (3a, 3b), and in that the metal-glass layer (6) is manufactured by heating a glass particle-containing metal until melting or softening of the glass particles occurs. The invention also relates to a method of manufacturing a temperature sensor and to a method of manufacturing such a connection.

Abstract: The invention relates to a circuit arrangement comprising an SMD-component (1), in particular a temperature sensor with a thermistor element (1), having two electroconductive contacts (2a, 2b), which are each conductively connected to a conductor track (3a, 3b) provided on a substrate (4). A firm, mechanical connection as well as a good electroconductive connection between the SMD-component and the conductor tracks is achieved in that the contacts (2a, 2b) are each made of a metal-glass layer (6) forming the connection to the conductor tracks (3a, 3b), and in that the metal-glass layer (6) is manufactured by heating a glass particle-containing metal until melting or softening of the glass particles occurs. The invention also relates to a method of manufacturing a temperature sensor and to a method of manufacturing such a connection.