Patents by Inventor Valeriv B. Kudryavtsev
Valeriv B. Kudryavtsev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6312980Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60°. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.Type: GrantFiled: June 5, 1998Date of Patent: November 6, 2001Assignee: LSI Logic CorporationInventors: Michael D. Rostoker, James S. Koford, Ranko Scepanovic, Edwin R. Jones, Gobi R. Padmanahben, Ashok K. Kapoor, Valeriv B. Kudryavtsev, Alexander E. Andreev, Stanislav V. Aleshin, Alexander S. Podkolzin
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Patent number: 5889329Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.Type: GrantFiled: August 21, 1995Date of Patent: March 30, 1999Assignee: LSI Logic CorporationInventors: Michael D. Rostoker, James S. Koford, Ranko Scepanovic, Edwin R. Jones, Gobi R. Padmanahben, Ashok K. Kapoor, Valeriv B. Kudryavtsev, Alexander E. Andreev, Stanislav V. Aleshin, Alexander S. Podkolzin
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Patent number: 5822214Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arrangement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.Type: GrantFiled: August 21, 1995Date of Patent: October 13, 1998Assignee: LSI Logic CorporationInventors: Michael D. Rostoker, James S. Koford, Ranko Scepanovic, Edwin R. Jones, Gobi R. Padmanahben, Ashok K. Kapoor, Valeriv B. Kudryavtsev, Alexander E. Andreev, Stanislav V. Aleshin, Alexander S. Podkolzin
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Patent number: 5808330Abstract: A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed. A novel device called a "tri-ister" is disclosed.Type: GrantFiled: August 21, 1995Date of Patent: September 15, 1998Assignee: LSI Logic CorporationInventors: Michael D. Rostoker, James S. Koford, Ranko Scepanovic, Edwin R. Jones, Gobi R. Padmanahben, Ashok K. Kapoor, Valeriv B. Kudryavtsev, Alexander E. Andreev, Stanislav V. Aleshin, Alexander S. Podkolzin
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Patent number: 5789770Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.Type: GrantFiled: August 21, 1995Date of Patent: August 4, 1998Assignee: LSI Logic CorporationInventors: Michael D. Rostoker, James S. Koford, Ranko Scepanovic, Edwin R. Jones, Gobi R. Padmanahben, Ashok K. Kapoor, Valeriv B. Kudryavtsev, Alexander E. Andreev, Stanislav V. Aleshin, Alexander S. Podkolzin