Patents by Inventor Van K. Chiem

Van K. Chiem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion
    Patent number: 5998237
    Abstract: A permanent curable photosensitive liquid dielectric polymer composition is disclosed for making copper printed circuit boards having at least one photosensitive dielectric polymer layer containing vias and circuitry thereon wherein the polymer layer has enhanced copper to dielectric adhesion. The dielectric composition preferably comprises an acrylated epoxy and a metal adhesion effective amount of amorphous silica. Printed circuit boards made using the photodefinable dielectric polymer and a method for making the printed circuit boards are also disclosed. A twice performed permanganate etching process for texturing the dielectric surface is also preferably used to further enhance the copper to dielectric adhesion.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: December 7, 1999
    Assignee: Enthone-OMI, Inc.
    Inventors: Jay B. Conrod, Van K. Chiem, Paul Menkin