Patents by Inventor Vanesa López Blanco

Vanesa López Blanco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with embedded component covered by functional film having an inhomogeneous thickness distribution
    Patent number: 11877388
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component embedded in the stack, and a functional film covering at least part of the component and having an inhomogeneous thickness distribution over at least part of a surface of the component.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 16, 2024
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Imane Souli, Vanesa López Blanco, Erich Preiner, Martin Schrei
  • Component carrier with embedded component connected in cavity by anchored first and second polymers
    Patent number: 11683884
    Abstract: A component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer, and a component embedded in the cavity of the stack and being at least partially covered by a second polymer, wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: June 20, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Imane Souli, Erich Preiner, Martin Schrei, Vanesa López Blanco
  • Component Carrier With a Via Containing a Hardened Filling Material
    Publication number: 20230156912
    Abstract: A component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; an opening located at least partially in the stack; and a fill material which is located within the opening. The fill material is a photosensitive material, wherein at least a part of the photosensitive material has undergone a hardening treatment with electromagnetic radiation. A method for manufacturing such a component carrier is further described.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 18, 2023
    Inventors: Shuying YAO, Abderrazzaq IFIS, Jens RIEDLER, Vanesa López BLANCO
  • Component Carrier With a Magnetic Element and a Manufacturing Method
    Publication number: 20220377896
    Abstract: A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 24, 2022
    Inventors: Ivan SALKOVIC, Vanesa LÓPEZ BLANCO
  • Component Carrier With Embedded Component Covered by Functional Film Having an Inhomogeneous Thickness Distribution
    Publication number: 20210400803
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component embedded in the stack, and a functional film covering at least part of the component and having an inhomogeneous thickness distribution over at least part of a surface of the component.
    Type: Application
    Filed: March 31, 2021
    Publication date: December 23, 2021
    Inventors: Imane Souli, Vanesa López Blanco, Erich Preiner, Martin Schrei
  • Component Carrier With Embedded Component Connected in Cavity by Anchored First and Second Polymers
    Publication number: 20210400808
    Abstract: A component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer, and a component embedded in the cavity of the stack and being at least partially covered by a second polymer, wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other.
    Type: Application
    Filed: June 21, 2021
    Publication date: December 23, 2021
    Inventors: Imane Souli, Erich Preiner, Martin Schrei, Vanesa López Blanco