Patents by Inventor Vason Srini

Vason Srini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Distributed integrated sensing and communication module
    Patent number: 11507087
    Abstract: A distributed integrated sensing and communication (DISC) module for an autonomous vehicle is described herein. The DISC module includes at least a first sensor system, a second sensor system, a processor, and memory. The first sensor system and the second sensor system are different types of sensor systems. The first sensor system outputs a first sensor signal, and the second sensor system outputs a second sensor signal. The DISC module can detect and track an object (or objects) based on the first sensor signal and the second sensor signal. Moreover, the DISC module can output data indicative of the object as detected. In the DISC module, the first sensor system, at least a portion of the second sensor system, the processor, and the memory are integrated on a single substrate.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: November 22, 2022
    Assignee: GM CRUISE HOLDINGS LLC
    Inventor: Vason Srini
  • DISTRIBUTED INTEGRATED SENSING AND COMMUNICATION MODULE
    Publication number: 20200142406
    Abstract: A distributed integrated sensing and communication (DISC) module for an autonomous vehicle is described herein. The DISC module includes at least a first sensor system, a second sensor system, a processor, and memory. The first sensor system and the second sensor system are different types of sensor systems. The first sensor system outputs a first sensor signal, and the second sensor system outputs a second sensor signal. The DISC module can detect and track an object (or objects) based on the first sensor signal and the second sensor signal. Moreover, the DISC module can output data indicative of the object as detected. In the DISC module, the first sensor system, at least a portion of the second sensor system, the processor, and the memory are integrated on a single substrate.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 7, 2020
    Inventor: Vason Srini