Patents by Inventor Vassilios Kalivas

Vassilios Kalivas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multichip module for surface mounting on printed circuit boards
    Patent number: 6154372
    Abstract: A ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board that belongs to a module and has circuit structures is provided. The ceramic substrate is contacted to the circuit structures with bond connections. The terminal elements are formed by approximately spherical accumulations of solder attached on the backside of the printed circuit board, these solder accumulations being connected to the circuit structures on the first side of the printed circuit board via through-contactings.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: November 28, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Vassilios Kalivas, Alois Nitsch, Heinz Peters