Patents by Inventor Vaughn Svendsen

Vaughn Svendsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder ball delivery and reflow method
    Patent number: 6634545
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: October 21, 2003
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
  • Solder ball delivery and reflow apparatus and method
    Patent number: 6386433
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: May 14, 2002
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
  • Solder ball delivery and reflow method
    Publication number: 20020053591
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Application
    Filed: November 7, 2001
    Publication date: May 9, 2002
    Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
  • Solder ball delivery and reflow apparatus and method of using the same
    Patent number: 6227437
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: May 8, 2001
    Assignee: Kulicke & Soffa Industries Inc.
    Inventors: Eli Razon, Vaughn Svendsen, Krishnan Suresh, Robert Kowtko, Kyle Dury