Patents by Inventor Veerendra Prakash Mulay

Veerendra Prakash Mulay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Data center cooling using a heat pipe
    Patent number: 11672105
    Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 6, 2023
    Assignee: Meta Platforms, Inc.
    Inventors: Seung H. Park, Marco Antonio Magarelli, Veerendra Prakash Mulay, David Abad Cenizal, Jacob Na, Sarah E. Hanna
  • DATA CENTER COOLING USING A HEAT PIPE
    Publication number: 20210227725
    Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.
    Type: Application
    Filed: December 18, 2020
    Publication date: July 22, 2021
    Inventors: Seung H. Park, Marco Antonio Magarelli, Veerendra Prakash Mulay, David Abad Cenizal, Jacob Na, Sarah E. Hanna