Abstract: In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient ?LS, which is substantially higher than the first thermal conductivity coefficient ?S of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.

Abstract: A device wafer comprises a silicon substrate, a piezoelectric layer arranged on and bonded to the silicon substrate and a structured metallization on top of the piezoelectric layer. The metallization forms functional device structures providing device functions for a plurality of electric devices that are realized on the device wafer. Semiconductor structures realize a semiconductor element providing a semiconductor function in the semiconductor substrate. Electrically conducting connections providing e.g. ohmic contact between the semiconductor structures and functional device structures such that at least one semiconductor function is controlled by a functional device structure or that at least one device function of the functional device structures is controlled by the semiconductor structures.

Abstract: A device wafer with functional device structures, comprises a semiconductor substrate (SU) as a carrier wafer, a piezoelectric layer (PL) arranged on the carrier wafer and functional device structures (DS) of a first and a second type realized by a structured metallization on top of the piezoelectric layer (PL). A space charge region is formed near the top surface of the carrier wafer to yield enhanced electrical isolation between functional device structures (DS) of first and second type.

Abstract: Certain aspects of the present disclosure provide a circuit, chip, and method for modifying crosstalk between an inductive component and an electrical component. One example circuit generally includes an electrical component, a variable inductive component comprising switches and one or more conductor paths, a controller configured to control the switches of the variable inductive component to modify crosstalk between the variable inductive component and the electrical component.

Abstract: The invention relates to an RF filter with reduced insertion loss. The filter (F) includes a first bandpass filter (BPF1) having a passband, a circuit unit (SE) having an undesired excitation at a critical frequency (fs) and a reflector (R) that reflects RF signals of this frequency before the circuit unit is undesirably excited and the power is lost as a result.

Abstract: In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient ?LS, which is substantially higher than the first thermal conductivity coefficient ?S of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.

Abstract: The present invention relates to a one-port resonator (1) operating with surface acoustic waves, comprising an interdigital transducer (2) having a first busbar (6), a second busbar (7) and electrode fingers (8), wherein in an excitation region (10) of the interdigital transducer (2) the electrode fingers (8) are alternately connected to the first busbar (6) and the second busbar (7) in the longitudinal direction (L), wherein the interdigital transducer (2) comprises a first reversed region (11), in which the electrode fingers (8) are alternately connected to the first busbar (6) and the second busbar (7) in the longitudinal direction (L) and which is directly adjacent to the excitation region (10), and wherein that electrode finger (118) of the first reversed region (11) which is directly adjacent to the excitation region (10) in the longitudinal direction (L) and that electrode finger (118) of the excitation region (10) which is directly adjacent thereto are connected to the same busbar (6, 7).

Abstract: A detector circuit can be used for determining the reflection coefficients of HF signals in a signal path. The detector circuit includes a bidirectional hybrid coupler, logarithmic amplifiers connected to the hybrid couple, and a subtractor having an offset connection.

Abstract: An acoustic wave component includes a layer system having a piezoelectric layer and a first metal layer arranged on the piezoelectric layer, a first resonator having a first electrode in the first metal layer, where the first metal layer includes electrode structures periodically arranged in a direction of propagation of a wave through the acoustic wave component, and a second resonator coupled to the first resonator and electrically isolated from the first resonator. The layer system includes a waveguide for guiding a guided bulk acoustic wave in a lateral direction of the acoustic wave component.

Abstract: A detector circuit can be used for determining the reflection coefficients of HF signals in a signal path. The detector circuit includes a bidirectional hybrid coupler, logarithmic amplifiers connected to the hybrid couple, and a subtractor having an offset connection.

Abstract: The invention relates to a circuit operating with bulk acoustic waves with at least electroacoustic systems, each arranged in a branch (Z1, Z2, Z3, Z4), wherein each electroacoustic system comprises at least two series-connected resonators (R11, R12; R21, R22; R31, R32; R41, R42) in the respective branch, which are galvanically separated from one another and acoustically coupled to one another by means of a coupling system (K1, K2, K3, K4) arranged therebetween. The electroacoustic systems are acoustically coupled via their coupling system (K1, K2) and/or electrically coupled to one another.

Abstract: A surface acoustic wave component includes a piezoelectric substrate and an electrode structure that includes multiple layers and that is on the piezoelectric substrate. A dielectric layer is above the electrode structure. The dielectric layer has an acoustic impedance Za,d. The multiple layers include a first layer system that includes at least one first layer made of a first material, which has an acoustic impedance that is less than 2Za,d. The second layer system includes at least one second layer made of a second material, which has an acoustic impedance that exceeds 2Za,d. The second layer system has a height that is between 15% and 85% of a total height of the multiple layers.

Abstract: An electrical circuit has at least two parallel signal paths connected to one another on the antenna side and for which a band reject filter corresponding to the transmission range is implemented in a second signal path for frequency-selective improvement of insertion loss in the transmission range of a first signal path. With a band reject filter, the signal is reflected to the junction of the parallel signal paths arising from the second signal path and thus is rerouted to the first signal path.

Abstract: A circuit for use with bulk acoustic waves includes a first electroacoustic system in a first branch and a second electroacoustic system in a second branch. The first electroacoustic system includes a first resonator and a second resonator that are in series in the first branch, and that are galvanically separated, and acoustically coupled, by a first coupling system. The second electroacoustic system includes a first resonator and a second resonator that are connected in series in the second branch, and that are galvanically separated, and acoustically coupled, by a second coupling system. The first and second electroacoustic systems are acoustically coupled via the first and second coupling systems and/or electrically coupled.

Abstract: The invention relates to a component operating with guided bulk acoustic waves, GBAW, with a layer system that comprises a piezoelectric layer (PS1) and a first metal layer (ME1) arranged thereon. The layer system forms a waveguide in which the guided bulk acoustic wave is guided in the lateral direction. The component comprises two resonators acoustically coupled to one another and electrically isolated from one another. The corresponding resonator comprises an electrode (A), formed in a metal layer (ME1), with electrode structures periodically arranged in the wave-propagation direction.

Abstract: A surface acoustic wave component includes a piezoelectric substrate and an electrode structure that includes multiple layers and that is on the piezoelectric substrate. A dielectric layer is above the electrode structure. The dielectric layer has an acoustic impedance Za,d. The multiple layers include a first layer system that includes at least one first layer made of a first material, which has an acoustic impedance that is less than 2Za,d. The second layer system includes at least one second layer made of a second material, which has an acoustic impedance that exceeds 2Za,d. The second layer system has a height that is between 15% and 85% of a total height of the multiple layers.

Abstract: A component operating with surface-proximal acoustic waves, in particular a filter with novel structure, has interdigital transducers arranged in serial and parallel branches, which are acoustically coupled with one another in different configurations. The component provides a loss-poor filter with simultaneously space-saving arrangement of the filter elements.

Abstract: An electrical circuit has at least two parallel signal paths connected to one another on the antenna side and for which a band reject filter corresponding to the transmission range is implemented in a second signal path for frequency-selective improvement of insertion loss in the transmission range of a first signal path. With a band reject filter, the signal is reflected to the junction of the parallel signal paths arising from the second signal path and thus is rerouted to the first signal path.

Abstract: A component operating with surface-proximal acoustic waves, in particular a filter with novel structure, has interdigital transducers arranged in serial and parallel branches, which are acoustically coupled with one another in different configurations. The component provides a loss-poor filter with simultaneously space-saving arrangement of the filter elements.