Abstract: A cooling system for a microchip or other component is described, including, in one embodiment: (1) a cold plate assembly positioned adjacent (e.g., in contact with) the component to be cooled; (2) at least one heat exchanger; (3) a fan for directing gas adjacent (e.g., through) a portion of the heat exchanger; and (4) a pump for circulating cooling fluid through a closed circuit including the cold plate and heat exchanger. The cold plate may include guide fins that define macrochannels and microchannels that serve as conduits for the cooling fluid. The fins and channels in one embodiment are shaped to substantially match the heat map profile of the chip or component to be cooled. The heat exchanger in one embodiment includes a reservoir in its base which may cooperate with a recess or channel in a support plate to form an additional cooling fluid flow passage.

Abstract: Integrated stacked microchannrel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter.

Abstract: Embodiments of the invention provide a three-dimensional nanotube structure. For one embodiment, a connector molecule is created that has bonding sites capable of bonding with one end of an open-ended nanotube segment and bonding sites capable of bonding with the corresponding bonding sites of a plurality of other connector molecules. For one embodiment, the connector molecule is cone-shaped, with base of the cone determined so as to bond with the edge of the open-ended nanotube and the point of the cone comprising a single molecule capable of bonding with the corresponding molecules of two or more other connector molecules. In one embodiment, the three-dimensional nanotube structures are incorporated into a polymer matrix to form a composite polymer having improved thermal conductivity. For one embodiment, the composite polymer is used to form efficient and cost-effective heat dissipation devices.

Abstract: Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter.

Abstract: An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.