Abstract: A method of reducing an inspection time required for inspecting a wafer with an automated inspection system. A target time is determined, to which the inspection time is to be reduced. A maximum number of analyses that the automated inspection system can perform during the target time is determined, and analysis of the wafer is limited to the maximum number of analyses, thereby enabling the automated inspection system to reduce the inspection time required to inspect the wafer to the target time. In this manner, the length of time required to inspect the wafer with the automated inspection system does not exceed the target time, because the number of inspections that can be performed within the target time has been determined. Thus, the inspection time for each wafer is kept to a desired level.