Patents by Inventor Venkata S. R. Kodukula

Venkata S. R. Kodukula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7274297
    Abstract: An RFID tag may include an antenna substrate comprising a conductive layer etched or deposited to form an antenna, and a circuit substrate comprising a conductive layer etched or deposited to form a circuit, the antenna electro-magnetically coupled to the circuit. An RFID tag may be formed from an insert substrate comprising an insulative layer between two conductive layers, one of the conductive layers etched to form an antenna and the other conductive layer etched to form a circuit. The insert substrate may be received in an envelope formed by a label substrate, which may carry a pressure sensitive adhesive.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: September 25, 2007
    Assignee: Intermec IP Corp.
    Inventors: Venkata S. R. Kodukula, For S. Lam, Rene D. Martinez
  • Patent number: 6535175
    Abstract: The present invention provides an RF tag having an antenna that can be selectively tuned to achieve optimal performance. The RF tag comprises an RF transponder integrated circuit and an antenna connected to the RF transponder integrated circuit. The antenna includes components such as tuning stubs and loading bars that are physically alterable to selectively vary the performance characteristics of the antenna. The tuning stub and loading bar may each further comprising a variably selectable length having elements that may be removed by punching, cutting, etching, laser trimming or other process. The antenna may further comprise a leadframe or a flexible substrate.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: March 18, 2003
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Thomas Anthony Cofino, Dah-Weih Duan, Daniel J. Friedman, Harley Kent Heinrich, Venkata S. R. Kodukula, Michael Brent Madrid, Paul Andrew Moskowitz, Philip Murphy, Michael Louis Pinch, Dale Larry Scott
  • Patent number: 6518885
    Abstract: The present invention is directed to an ultra-thin outline package for integrated circuits that is much smaller than conventional chip packaging structures. The ultra-thin outline package is particularly useful in fabricating RF or RFID transponders. In an embodiment of the invention, the ultra-thin outline package includes a substrate having an aperture. At least one conductive trace that includes upper and lower portions is disposed on respective upper and lower surfaces of the substrate. The substrate further comprises at least one via electrically connecting the conductive trace portions together. An integrated circuit is disposed in the aperture and is operatively coupled to the upper portion of the conductive trace. An encapsulant is provided in the aperture substantially covering the integrated circuit. The lower portion of the conductive trace is adapted for coupling of the ultra-thin outline package to a secondary substrate using conventional surface mounting techniques.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: February 11, 2003
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Venkata S. R. Kodukula
  • Patent number: 6441740
    Abstract: An improved radio frequency transponder has a reflector to increase its operative range. A system of one or more reflectors is operatively associated with a transponder and may be formed out of any sort of radio frequency reflective material. The reflector system can enhance reception or transmission of radio waves by or from the transponder. The reflector system may also be used to provide for selective coupling of the radio frequency transponder with a base station, user- or vehicle-supported reader, or the like based on relative orientation. In addition, the reflector system may be used to selectively reflect particular radio waves.
    Type: Grant
    Filed: February 27, 1999
    Date of Patent: August 27, 2002
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Dah-Weih Duan, Venkata S. R. Kodukula, Paul Andrew Moskowitz
  • Publication number: 20020003496
    Abstract: The present invention provides an RF tag having an antenna that can be selectively tuned to achieve optimal performance. The RF tag comprises an RF transponder integrated circuit and an antenna connected to the RF transponder integrated circuit. The antenna includes components such as tuning stubs and loading bars that are physically alterable to selectively vary the performance characteristics of the antenna. The tuning stub and loading bar may each further comprising a variably selectable length having elements that may be removed by punching, cutting, etching, laser trimming or other process. The antenna may further comprise a leadframe or a flexible substrate.
    Type: Application
    Filed: January 19, 2001
    Publication date: January 10, 2002
    Inventors: Michael John Brady, Thomas Anthony Cofino, Dah-Weih Duan, Daniel J. Friedman, Harley Kent Heinrich, Venkata S. R. Kodukula, Michael Brent Madrid, Paul Andrew Moskowitz, Philip Murphy, Michael Louis Pinch, Dale Larry Scott
  • Patent number: 6320509
    Abstract: A radio frequency identification transponder has a high gain antenna for increased range. In an embodiment, the radio frequency transponder has a reflector to increase its operative range. A system of one or more reflectors is operatively associated with a transponder and may be formed out of any sort of radio frequency reflective material. The reflector system can enhance reception or transmission of radio waves by or from the transponder. The reflector system may also be used to provide for selective coupling of the radio frequency transponder with a base station, user- or vehicle-supported reader, or the like based on relative orientation. In addition, the reflector system may be used to selectively reflect particular radio waves. In another embodiment, the radio frequency transponder has a horn antenna providing increased gain and directivity. In yet another embodiment, the radio frequency transponder has a patch antenna providing increased gain and circular polarization.
    Type: Grant
    Filed: August 16, 1999
    Date of Patent: November 20, 2001
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Dah-Weih Duan, Venkata S. R. Kodukula, Rene D. Martinez, Paul Andrew Moskowitz, Philip Murphy
  • Patent number: 6285342
    Abstract: An RF transponder is provided with a miniature resonant antenna that can fit on a small form factor the size of a button or coin. More particularly, the RF transponder comprises a substrate and an RF integrated circuit disposed thereon. An antenna is provided on the substrate and is electrically connected to the RF integrated circuit. The antenna has a contorted shape that permits it to fit into the limited available space on the substrate, while having an electrical length that is greater than a maximum length dimension of the substrate. Possible shapes for the antenna may include a meander antenna, a non-uniform meander antenna, a bent dipole antenna, a spiral antenna, a z-shaped dipole, a squeezed dipole antenna, or a combination of any of the antenna types. The RF transponder may further include at least one loading bar spaced from the antenna and/or at least one tuning stub coupled to the antenna.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: September 4, 2001
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Dah-Weih Duan, Venkata S. R. Kodukula
  • Patent number: 6249227
    Abstract: Methods and apparatus applying RFID technology to identify electronic components, devices, and systems to provide functions such as, for example, security of the assets, inventory tracking of the assets, identification of the assets, and short distance communication between the assets are disclosed. RFID transponders are integrated into electronic components, devices and systems at the component level (i.e., circuit chip, circuit board, etc.), the asset level (i.e., box, computer, etc.), or system level (i.e., network system, computer system, etc.).
    Type: Grant
    Filed: November 4, 1998
    Date of Patent: June 19, 2001
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Paul W. Coteus, Dah-Weih Duan, Venkata S. R. Kodukula, Paul Andrew Moskowitz, Alejandro Gabriel Schrott, Robert Jacob Von Gutfeld, James Peter Ward
  • Patent number: 6201474
    Abstract: A magnetic tape information storage media includes a cassette housing having one or more spools for holding a length of magnetic tape and an integral radio frequency identification (RFID) transponder. The RFID transponder may be utilized by an external system to provide functions such as, automated sale, rental, or loan of the media, authentication of the media, indexing of information recorded to the media, enablement/disablement of playback of the media, recording of the number of times the media has been played, inventory, and the like.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: March 13, 2001
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Dah-Weih Duan, Venkata S. R. Kodukula
  • Patent number: 6195053
    Abstract: A symbology reader includes an optical reading assembly received in a reading assembly housing and an antenna shaped to conform to at least a portion of the reading assembly housing and in contact therewith. The antenna can be shaped to form at least a partial enclosure for the optical reading assembly, thus eliminating part or all of the reading housing assembly. A module for use in an imager can include an optical reading assembly mounted in a housing and an antenna having a shape that is complimentary to a shape of at least a portion of the housing. Similarly, an antenna for an imager can include a conductive member having a shape at least partially conforming to a shape of a reading assembly housing in an imager.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: February 27, 2001
    Assignee: Intermec IP Corp.
    Inventors: Venkata S. R. Kodukula, H. Sprague Ackley
  • Patent number: 6121878
    Abstract: A system for controlling assets for inventory, loss-control, or monitoring. The system includes a combination RFID and EAS tag and a reader.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: September 19, 2000
    Assignee: Intermec IP Corp.
    Inventors: Michael John Brady, Dah-Weih Duan, Harley Kent Heinrich, Venkata S. R. Kodukula
  • Patent number: 6118379
    Abstract: A radio frequency identification (RFID) transponder (tag) includes a spiral over ground plane antenna. The RFID tag includes a RFID circuitry that may be implemented as an RFID tag integrated circuit and may be mounted on one surface of a substrate such as a printed circuit board. The RFID tag circuitry may be electrically connected to an impedance matching circuit printed on the same side of printed circuit board. The matching circuit is electrically connected to a spiral antenna that may be mounted on same side of the printed circuit board as the tag circuit and matching circuit. The spiral antenna is held a prescribed distance from the ground plane in order to maximize the gain of the RFID tag and to thereby maximize the range of the RFID tag.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: September 12, 2000
    Assignee: Intermec IP Corp.
    Inventors: Venkata S. R. Kodukula, Dah-Weih Duan, Michael John Brady
  • Patent number: 6100804
    Abstract: A radio frequency identification system employing a thin, flexible electronic radio frequency identification (RFID) tag having an overall thickness not exceeding approximately 280 microns and the process for its manufacture is disclosed. The RFID tag includes an insulating, flexible substrate having an aperture formed therein for receiving an RFID circuit chip. An antenna forming an integral part of the substrate is electrically connected to circuit chip. A cured adhesive having a portion substantially parallel with the substrate encapsulates the circuit chip so that the chip is operably retained within the substrate aperture.
    Type: Grant
    Filed: October 29, 1998
    Date of Patent: August 8, 2000
    Assignee: Intecmec IP Corp.
    Inventors: Michael J. Brady, Dah-Weih Duan, Venkata S. R. Kodukula