Abstract: An apparatus for containing electromagnetic interference (EMI). The apparatus includes an enclosure for an EMI producing component. The enclosure has a set of springable tabs extending from a top edge of the enclosure and a set of pins extending from a bottom edge of the enclosure. The pins are placed through a grounding ring and a printed circuit board to align and ground the enclosure. The tabs contact a heatsink disposed over the enclosure.

Abstract: A shielding apparatus for containing electromagnetic energy is disclosed. In one embodiment, a shield includes a plurality of sides, each side having a top and a bottom. A flange may extend from the top of the sides. A plurality of tabs extend from the flanges. The tabs include a first, second, and third portions. The first portion extends directly from the flange. The second portion extends at an angle from the first portion relative to the plane of the first portion and the flange. The longitudinal axis of the second portion is parallel to its associated flange or side. A third portion extends from the second portion, at an angle relative, to the second portion. A heat sink coated with an electrically conductive material may be mounted such that a bottom side of the heat sink is in contact with the plurality of tabs.

Abstract: A heat sink assembly includes a retainer having a body, a finger extending from the body and legs extending from the body. The assembly further includes a heat sink having a base and fins extending from the base, where slits in the fins define a trench. A package which includes an electronic device is located between a circuit board and the heat sink and the retainer holds the heat sink in place. To secure the heat sink with the retainer, the retainer is positioned so that the finger of the retainer is aligned with the trench of the heat sink and the legs of the retainer are aligned to slide around the circuit board. The retainer is then moved to slide the finger into the trench and the legs around the circuit board.

Abstract: A fan shroud includes a faceplate having slots. Spacer panels and a top plate extend from the faceplate. Hook-like locking features extend from the spacer panels and locking flanges extend from the top plate. To secure a fan in place, the fan shroud is mounted to a rack of a computer system using the hook-like locking features and the locking flanges. The faceplate of the fan shroud is adjacent to and secures the fan in place.

Abstract: A heat sink structure includes a heat emitting component, an inner heat sink in thermal contact with the heat emitting component, a cabinet of a computer system in thermal contact with the inner heat sink, and an outer heat sink in thermal contact with the cabinet. The cabinet defines an outer region outside of the computer system and an inner region inside of the computer system. Generally, the outer region is cooler than the inner region. Advantageously, since the outer heat sink is located in the outer region, the outer heat sink is relatively cool compared to the heat emitting component. This drives heat from the heat emitting component through the inner heat sink and the cabinet to the outer heat sink, which dissipates this heat to the outer region outside of the computer system.

Abstract: A heat sink structure includes a lower heat sink in thermal contact with a heat emitting component. The heat sink structure further includes an upper heat sink and at least one heat pipe extending from the lower heat sink to the upper heat sink. At least one spring urges the upper heat sink away from the lower heat sink and into thermal contact with a cabinet, sometimes called a cover or a lid, of a computer system. During use, the heat emitting component generates heat. This heat is conducted to the lower heat sink, the upper heat sink, and the cabinet. The cabinet dissipates heat to the outside of the computer system.

Abstract: A heat sink structure includes a lower heat sink in thermal contact with a heat emitting component. The heat sink structure further includes an upper heat sink and at least one heat pipe extending from the lower heat sink to the upper heat sink. At least one spring urges the upper heat sink away from the lower heat sink and into thermal contact with a cabinet, sometimes called a cover or a lid, of a computer system. During use, the heat emitting component generates heat. This heat is conducted to the lower heat sink, the upper heat sink, and the cabinet. The cabinet dissipates heat to the outside of the computer system.

Abstract: A heat sink structure includes a fan, a heat sink and a fan mounting bracket. The heat sink includes a base section having a lower surface and an upper surface. A first fin and a second fin extend from the upper surface of the base section. The fan mounting bracket includes a faceplate, a first side extending from the faceplate, and a second side extending from the faceplate. The first side and second side of the fan mounting bracket are fastened to the first fin and the second fin, respectively. The fan is mounted to the faceplate of the fan mounting bracket such that the fan is mounted horizontally to the heat sink.

Abstract: A heat sink structure includes first and second add-on heat sinks mounted to a primary heat sink. The add-on heat sinks are thermally connected to the primary heat sink such that the effective heat transfer surface area for dissipating heat to the ambient environment is increased compared to the surface area of the primary heat sink alone. Increasing the effective heat transfer surface area enhances heat transfer from the primary heat sink. The add-on heat sinks also restrict air from flowing between the primary heat sink and a cabinet of the computer system. In this manner, the add-on heat sinks force air to flow between the fins of the primary heat sink, thus further enhancing heat transfer from the primary heat sink.

Abstract: A heat sink assembly includes a heat sink, a circuit board and an integrated circuit package. The package is located between the heat sink and the circuit board and attached to a die attach area of the circuit board. A heat sink retainer attached to the heat sink has a base section located adjacent to the circuit board directly opposite the die attach area. The retainer presses the heat sink down uniformly on the package. Further, the downward force applied to the heat sink is countered by an equal upward force applied by the base section of the retainer on the circuit board. Since the base section is located directly opposite the die attach area, the upward force is transferred from the base section directly back to the heat sink without imparting any bending force on the circuit board.

Abstract: A clip assembly tool for grasping the finger and legs of a retainer and spreading them apart from one another includes a lower arm having a first clasp and an upper arm having a second clasp. The lower arm is pivotally attached to the upper arm. The tool further includes a wedge arm having a nose, where the wedge arm is pivotally attached to the upper arm. To use the tool, the second clasp is moved away from the first clasp and the retainer is inserted between the first and second clasps. The second clasp is then moved back towards the first clasp. The nose of the wedge arm then wedges the legs and finger of the retainer in first and second catchs of the first and second clasps, respectively. The second clasp is then again moved away from the first clasp. Since the legs and finger are securely fastened to the first and second catches, respectively, the finger is spread from the legs.

Abstract: A method and apparatus improve the thermal interface between a heat sink and a semiconductor. A support member is attached to a bias plate to facilitate a fixed connection with a surface. The bias plate has a beam for alignment with a heat sink that is attached to the semiconductor. The bias plate is attached to the support member such that the support member forces the beam against the heat sink to improve the thermal interface between the heat sink and the semiconductor. In the method, a heat sink is attached to a semiconductor, and a pivoting beam is biased against the heat sink such that the thermal interface with the semiconductor is improved.

Abstract: A heat sink assembly includes a heat sink having torque bars, the torque bars including lips and guides extending from the lips. A package is located between the heat sink and a circuit board. A heat sink retainer includes riser arms and ends connected to the riser arms, where the ends press against the lips. The riser arms press the guides towards the package and press apertures of the heat sink away from the package. In this manner, the retainer imparts torque on the heat sink which causes the heat sink to impart a downward force on the package. This downward force creates the thermal contact between the heat sink and the package.

Abstract: An improved memory module for mounting chips. The memory module has a circuit board which is at least partially flexible between a first part and a second part. The first part is mounted horizontally over a second circuit board, such as a mother board. The second part is then bent upward, with the memory chip(s) being mounted on the second part of the circuit board. A heat sink is mounted so that it contacts both the first, horizontal part of the circuit board, and the memory chip(s).