Abstract: A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

Abstract: A method for fabricating transient voltage protection devices is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection and includes specific ceramic materials designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.

Abstract: A transient voltage protection device is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection includes specific ceramic materials having a density of less than 3.8 gm/cm.sup.3 designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.

Abstract: A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.

Abstract: A subminiature circuit protector includes an electrically insulating substrate, a fuse element connecting end termination pads, the termination pads extending to end and lateral edges of the substrate, an electrically insulation cover over the fuse element and termination pads, and end terminations formed over the end and a portion of the lateral surfaces of the substrate electrically connecting with the termination pads.

Abstract: A subminiature fuse comprising two terminals, a substrate, a fusible conductor, ceramic coating, a second coating and a unitary housing. A ceramic substrate 80 plated at both ends is inserted into fingers (70) in terminal, a fusible wire element 10 is strung between the fingers (70) and (20, 30) and electrically connects the terminal (20, 30). The assembly 160 is encased in a ceramic adhesive 180 which is encased in a second material (200) with superior dielectric properties. The ceramic encased assembly is enclosed in a unitary housing by injection molding.

Abstract: A terminal adapter for a cartridge fuse accommodating the installation of the fuse in fuse holders of a different size and type while at time insuring the installation of the proper class of fuse in a particular application.

Abstract: A subminiature fuse is disclosed comprising two terminals, a substrate, a fusible conductor, and a unitary housing. The unitary housing is sealed and provides increased mechanical strength, thus reducing the risk of a catastrophic failure of the fuse. The upper portion of the fuse terminals are shaped into finger like projections adaptable to mechanically fastening the fusible conductor and the substrate thereto thus facilitating the manufacturing process. In one embodiment the fusible conductor and adjacent portions of the terminals and substrate are coated with a ceramic coating or adhesive. The housing is sealed by ultrasonic welding or preferably in an insert molded plastic enclosure which is substantially devoid of air.