Abstract: Technologies are shown for automatically registering items in an automated physical shopping cart involving receiving image data for items in the cart, detecting a change in a weight of items in the cart and, determining whether a correlated item was identified in the image data. If no correlated item was identified, a message is displayed indicating that no correlated item was detected and a user can be prompted. A user device may be used to scan items and display messages for the cart. Items may be scanned using image recognition to determine item information. An item weight may be determined based on the change in the weight of items in the cart and priced accordingly to weight. A notification for an item in the cart may be provided to an inventory or a shopping list application indicating that the correlated item was added to the cart.

Abstract: An assisted content authoring productivity tool can provide a set of structured content related to at least one topic determined from a user's expression of intent. Additional information can be obtained about a selected result from the set of structured content through the assisted content authoring productivity tool by using the set of structured content as context for the further search. An item from the set of structured content can be inserted into a document in a content authoring surface of a content authoring application. The insertion may be carried out cross-device. Topics for the search of structured content can be determined using the user's expression of intent and, once available, the context can include the results of previous searches for the structured content related to at least one topic determined from the user's expression of intent. Each additional search results may provide further context in a recursive manner.

Abstract: An assisted content authoring productivity tool can provide a set of structured content related to at least one topic determined from a user's expression of intent. Additional information can be obtained about a selected result from the set of structured content through the assisted content authoring productivity tool by using the set of structured content as context for the further search. An item from the set of structured content can be inserted into a document in a content authoring surface of a content authoring application. The insertion may be carried out cross-device. Topics for the search of structured content can be determined using the user's expression of intent and, once available, the context can include the results of previous searches for the structured content related to at least one topic determined from the user's expression of intent. Each additional search results may provide further context in a recursive manner.

Abstract: The boot having skin-exfoliating means therein is a normal boot that when worn targets different regions of a foot and exfoliates dead skin from said regions of the foot, but in different exfoliating manners. The exfoliating means are designed to massage and exfoliate dead skin from the foot of an end user. The exfoliating means comprise massaging nodes aligned along a front, interior of the boot, which target skin between toes. Another exfoliating means is included along a middle region of the sole and includes an array of nodes that exfoliate skin along a bottom surface of the foot. Exfoliating ridges are located on two regions of the sole and are adapted to exfoliate skin at the rear of the foot and between the array of nodes and massaging nodes. Edge ridges adorn a periphery of the sole and provide additional exfoliating means.

Abstract: A mobile power system includes a first transportable body including a generator assembly and a second transportable body including a turbine assembly. One end of the second transportable body is attached to and faces an end of the first transportable body such that the first and second transportable bodies are generally collinear. The mobile power system also includes a third transportable body including auxiliary equipment and a fourth transportable body including electrical equipment. The third transportable body includes a portion that is generally aligned with at least a portion of the first and second transportable bodies along a direction that is generally perpendicular to a longitudinal direction of the third transportable body. The third transportable body is located between the fourth transportable body and the first and second transportable bodies. The first, second, third, and fourth transportable bodies are substantially parallel and are separately transportable.

Abstract: A mobile power system includes a first transportable body including a generator assembly and a second transportable body including a turbine assembly. One end of the second transportable body is attached to and faces an end of the first transportable body such that the first and second transportable bodies are generally collinear. The mobile power system also includes a third transportable body including auxiliary equipment and a fourth transportable body including electrical equipment. The third transportable body includes a portion that is generally aligned with at least a portion of the first and second transportable bodies along a direction that is generally perpendicular to a longitudinal direction of the third transportable body. The third transportable body is located between the fourth transportable body and the first and second transportable bodies. The first, second, third, and fourth transportable bodies are substantially parallel and are separately transportable.

Abstract: A method for fabricating an electrical interconnection element, or conductive structure, includes disposing a jacket of a first member of the electrical interconnection element laterally around a contact of a semiconductor device structure and introducing conductive material into the jacket. The jacket, which may be electrically insulative, may include a plurality of adjacent, mutually adhered regions. Such regions may be formed by programmed material consolidation processes, such as stereolithography, in which material is selectively consolidated in a manner controlled by a program. The first member is configured to interconnect with a second member of the electrical interconnection element, which may be secured to and electrically communicate with a contact of another semiconductor device component.

Abstract: A method of electrically connecting corresponding contact pads of semiconductor device components to each other includes interconnecting first and second members of an interconnection element. The first and second members respectively protrude from first and second semiconductor device components, with a conductive element of each member in communication with a contact pad of its corresponding semiconductor device component. Each member of the interconnection element also includes an insulative coating, or shell. When the first and second member of an interconnection element are interconnected, the insulative coating, or shell, may substantially cover or encase the conductive elements of the interconnection element.

Abstract: Methods for forming conductive elements of substrates of components that are configured for use in electronic devices includes providing unconsolidated material over at least a portion of such a substrate and at least partially consolidating the material selectively or in accordance with a program. Such consolidation may be effected by directing consolidating energy, in the form of focused (e.g., laser) radiation or otherwise, toward the unconsolidated material. Additionally, all or part of a substrate may be formed by programmed material consolidation processes.

Abstract: A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

Abstract: A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

Abstract: An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater degree, mold compound not removed during a deflashing procedure does not flake off to form mold compound debris during a trimming and forming procedure. By adhering to mold compounds to a lesser degree, substantially all of the mold compound is removed during the deflashing procedure so there is no mold compound to flake off to form mold compound debris during the trimming and forming procedure. The leadframe rails may be treated by forming apertures in the rails, by increasing or decreasing the roughness of the leadframe rails, or by coating the leadframe rails with an adhesion promoting or reducing material.

Abstract: A flip-chip type semiconductor device includes at least one conductive element with a plurality of adjacent, mutually adhered regions. The at least one conductive element may include a laterally extending conductive element of the type that reroutes the connection pattern of a semiconductor die or a conductive element that protrudes from a contact pad of the flip-chip type semiconductor device. The at least one conductive element may be formed by programmed material consolidation; e.g., stereolithography. A flip-chip type semiconductor device with one or more conductive elements that are at least partially laterally extending may also include a carrier or other dielectric layer that isolates the conductive elements and their corresponding contact pads from the active surface of a semiconductor die. A protective layer may also cover at least laterally extending portions of such conductive elements. The dielectric layers or protective layers may be formed by programmed material consolidation.

Abstract: Conductive elements that include a plurality of adjacent, mutually adhered regions are disclosed. All of the regions may include the same type of material. At least a portion of such a conductive element may be configured to extend laterally. In a semiconductor device assembly, such a conductive element is in electrical communication with a contact of at least one semiconductor device component, and may extend between corresponding contacts of two or more semiconductor device components.

Abstract: A carrier substrate includes a substrate and at least one conductive element. The at least one conductive element may include a plurality of adjacent, mutually adhered regions, which may include the same type of material. A portion of the at least one conductive element may be disposed within a recess formed in a surface of the substrate. The at least one conductive element may include a portion that extends through the substrate.

Abstract: Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convoluted passageways therethrough to enhance air flow. An optical recognition may be used in conjunction with programmed material consolidation processes to ensure that a heat sink is fabricated or positioned on the appropriate location of an electronic component, such as a semiconductor device.

Abstract: Methods for fabricating conductive structures on contact pads of semiconductor device components or other electronic components and for securing conductive structures to contact pads include directing consolidating energy toward unconsolidated conductive material. Alternatively, an unconsolidated material that will consolidate without additional consolidating energy may be used to form such conductive structures, in which case layers of the unconsolidated material are merely defined. Consolidating energy may be directed or layers of unconsolidated conductive material defined by recognizing the locations or orientations of one or more features, such as a contact, of the semiconductor device component or other electronic component. The conductive elements may include, but are not limited to, discrete conductive structures that protrude from the contacts, conductive traces that extend laterally from the contacts, or vias of circuit boards, interposers, or semiconductor devices.

Abstract: A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

Abstract: Selectively consolidated conductive elements. The conductive elements may include multiple, mutually adhered regions that comprise conductive material, such as a thermoplastic conductive elastomer or a metal. In semiconductor device assemblies, the conductive elements may electrically connect contacts of semiconductor device components to one another. The conductive elements may alternatively comprise conductive traces or vias of circuit boards or interposers. Selective consolidation processes may be employed to fabricate the conductive elements. Such processes may include use of a machine vision system with at least one camera operably associated with a computer controlling consolidation or application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the conductive element is to be fabricated.

Abstract: A heat-resisting weldable alloy consisting essentially of, by weight percent, 01. to 0.4 aluminum, 0.001 to 0.008 calcium, 0.002 to 0.1 magnesium, 0 to 0.08 carbon, 0 to 1 manganese, 0 to 0.002 sulfur, 0 to 1 silicon, 0 to 0.75 copper, 0 to 0.3 phosphorus, 18 to 22 nickel, 18 to 22 chromium, and the balance iron and incidental impurities.