Patents by Inventor VICENTIU GROSU

VICENTIU GROSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING STRATEGY FOR LARGE AREA METAL-CLADDED CERAMIC SUBSTRATE
    Publication number: 20160255747
    Abstract: A number of variations may include a device that may include a first substrate having at least one concentrically ground surface; and a second substrate overlying the first substrate in a hexagonally-arrayed print pattern.
    Type: Application
    Filed: February 27, 2015
    Publication date: September 1, 2016
    Inventors: VICENTIU GROSU, ANDREW A. WERESZCZAK
  • Scalable and modular approach for power electronic building block design in automotive applications
    Patent number: 9295184
    Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: March 22, 2016
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Mark D. Korich, Vicentiu Grosu, David Tang, Gregory S. Smith, Konstantinos Triantos
  • Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components
    Patent number: 8967453
    Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: March 3, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Khiet Le, Vicentiu Grosu, Gregory S. Smith, Yunqi Zheng, Gregory D. Rosdahl
  • SCALABLE AND MODULAR APPROACH FOR POWER ELECTRONIC BUILDING BLOCK DESIGN IN AUTOMOTIVE APPLICATIONS
    Publication number: 20140168900
    Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 19, 2014
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: MARK D. KORICH, VICENTIU GROSU, DAVID TANG, GREGORY S. SMITH, KONSTANTINOS TRIANTOS
  • ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES
    Publication number: 20130279119
    Abstract: Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.
    Type: Application
    Filed: May 25, 2012
    Publication date: October 24, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Vicentiu GROSU, Mark D. KORICH, Terence G. WARD, Gregory S. SMITH
  • METHODS OF BONDING COMPONENTS FOR FABRICATING ELECTRONIC ASSEMBLIES AND ELECTRONIC ASSEMBLIES INCLUDING BONDED COMPONENTS
    Publication number: 20130250538
    Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
    Type: Application
    Filed: March 21, 2012
    Publication date: September 26, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: KHIET LE, VICENTIU GROSU, GREGORY S. SMITH, YUNQI ZHENG, GREGORY D. ROSDAHL
  • ATTACHMENT ARRANGEMENT FOR A HEAT SINK
    Publication number: 20110186265
    Abstract: An attachment arrangement for a heat sink includes, but is not limited to, an attachment surface defined on the heat sink. A thermally conductive adhesive is disposed on the attachment surface. A substrate is attached to the attachment surface via the thermally conductive adhesive. The thermally conductive adhesive defines a discontinuity that is disposed in a delamination path of the thermally conductive adhesive.
    Type: Application
    Filed: February 4, 2010
    Publication date: August 4, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: YUNQI ZHENG, VICENTIU GROSU, KHIET LE, MARK D. KORICH