Abstract: An IMR (in-mold roller or in-mold release)/IMF (in-mold forming) making method using a digital printer printing and pre-forming technique is disclosed to employ a digital printing technique to prepare a release layer, a protective wear-resistance layer (durable layer), an ink pattern layer, a metal pattern layer and a bonding layer (adhesive layer). In-mold roller or in-mold forming film is shaped and then molded on a plastic material through an injection-molding or pressure-casting technique so that the finished product is obtained after release from the mold and removal of the outer base layer. Further, shaped in-mold decoration film is put in an injection-molding mold or pressure-casting mold for molding and then the molded product is cut into the desired shape, finishing the fabrication. Trimming process may be applied to the shaped in-mold forming film before injection molding or pressure casting.

Abstract: A method for making a transfer-pattern thin film includes the step of preparing a compound mixture by mixing a hard coat material and a release material with a water-based, neutral or oil-based solvent, and the step of applying the compound mixture thus obtained to the surface of a thin film substrate, so that, due to the difference in specific gravity or molecule surface extension, or due to the effect of repulsive force, reaction mechanism or bonding force of physical changes and chemical actions, or of the difference in reaction rate, the hard coat substance and release substance are separated in the compound mixture to form a hard coat layer and a release layer, wherein the release layer is between the thin film substrate and the hard coat layer.

Abstract: A structure of combined metal casing and plastic member comprises a metal casing, a plastic member and an adhesive tape bonded between the metal casing and the plastic member. The adhesive tape is prepared by applying an adhesive bonding agent to a narrow elongated absorptive substrate by means of coating, spray-painting or printing. By means of using the adhesive tape to bond the plastic member to the metal casing, the plastic member is firmly secured to the metal casing, simplifying rapid fabrication and reducing the product manufacturing cost.

Abstract: An IMR (in-mold roller or in-mold release)/IMF (in-mold forming) making method using a digital printer printing and pre-forming technique is disclosed to employ a digital printing technique to prepare a release layer, a protective wear-resistance layer (durable layer), an ink pattern layer, a metal pattern layer and a bonding layer (adhesive layer). In-mold roller or in-mold forming film is shaped and then molded on a plastic material through an injection-molding or pressure-casting technique so that the finished product is obtained after release from the mold and removal of the outer base layer. Further, shaped in-mold decoration film is put in an injection-molding mold or pressure-casting mold for molding and then the molded product is cut into the desired shape, finishing the fabrication. Trimming process may be applied to the shaped in-mold forming film before injection molding or pressure casting.

Abstract: A method for making a transfer-pattern thin film includes the step of preparing a compound mixture by mixing a hard coat material (durable agent) and a release material (release agent) with a water-based, neutral or oil-based solvent, and the step of applying the compound mixture thus obtained to the surface of a thin film substrate, so that, due to the difference in specific gravity or molecule surface extension, or due to the effect of repulsive force, reaction mechanism or bonding force of physical changes and chemical actions, or of the difference in reaction rate, the hard coat substance and release substance are separated in the compound mixture to form a hard coat layer and a release layer between the thin film substrate and the hard coat layer.

Abstract: A method for making a thin film having a metallic pattern layer includes covering a release layer on the surface of a thin film substrate to leave a blank area of a predetermined pattern in the release layer, covering a metal layer on the release layer and the blank area, covering the metal layer with an adhesive layer, adhering a substrate-based thin film to the adhesive layer, and removing the substrate-based thin film to remove the part of the metal layer outside said blank area and the release layer together with the adhesive layer and the substrate-based thin film from the thin film substrate so that a metallic pattern layer is left on the thin film substrate for RFID (radio frequency identification) system, antennas of wireless transmission system, flexible printed circuit boards or chip on film (chip on flex) applications.

Abstract: An IMD (in-mold decoration)/IMR (in-mold roller or in-mold release) transfer pattern method includes the steps of (a) preparing an in-mold transfer-pattern film, (b) processing the in-mold transfer-pattern film into a predetermined three-dimensional shape fitting the configuration of the desired finished product, (c) inserting the three-dimensional in-mold transfer-pattern film in an injection-molding mold for molding with a plastic material and (d) removing the molded product from the injection-molding mold after the injection-molding mold has been cooled down and then removing the thin film substrate and the release layer of the in-mold transfer-pattern film from the molded product. This method prevents the in-mold transfer-pattern film from wrinkling or cracking during injection-molding so that the finished product has a smooth perfect surface.

Abstract: An LED fabrication method for fabricating LEDs comprises: covering all the P-contacts and N-contacts on a wafer with a hydrophilic resin mask layer, packaging the wafer with an organic or inorganic polymer compound containing a yellow fluorescent powder (or a mixture of red and green fluorescent powders), employing a water washing process to remove the hydrophilic resin mask layer so that all the P-contacts and the N-contacts are exposed to the outside, and saw-cutting the wafer into individual dies and wire-bonding the P-contact and N-contact of each die with a respective gold wire.

Abstract: Both in mold film and in mold label with a 2D or 3D pattern include a base layer, which has a flat inner surface and an outer surface that can be a 2D visual surface or 3D grating surface, a pattern layer printed on the inner surface of the base layer to show a 2D or 3D pattern, a protective layer prepared from a polymer material having high temperature resistance, acid resistance and alkali resistance characteristics and printed on the pattern layer, and an adhesion layer covered on the protective layer. In an alternate form, an anti-EMI layer is sandwiched between the protective layer and the adhesion layer for electromagnetic interference protection.

Abstract: A flexible PC board made through a water cleaning process includes a substrate prepared from polymers or copolymers such as PET, PI, PP, PS, PMMA, PC, PU, PBT, ABS, nylon, etc. A release layer prepared from a hydrophilic material and printed on the substrate to leave a blank zone on the substrate according to a predetermined circuit pattern, and a conduction layer bonded to the blank zone to form a circuit pattern. An electroplating process may be employed to increase the thickness of the circuit pattern formed of the conduction layer. Through a water cleaning process, the release layer is removed from the substrate, and the desired flexible PC board is obtained for bonding to a member of an electronic product by means of injection or pressure casting molding.